Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

Reliability test and failure analysis of high‐density packages assembled with a... Purpose – The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low‐melting temperature lead‐free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag). Design/methodology/approach – The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag) are investigated. Findings – Lead‐free solder‐joint reliability of high‐density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44 min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi‐II Products SPEC have also been reported. Originality/value – Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead‐free soldering. The paper contains some important research results and recommendations. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

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Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910810871539
Publisher site
See Article on Publisher Site

Abstract

Purpose – The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low‐melting temperature lead‐free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag). Design/methodology/approach – The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag) are investigated. Findings – Lead‐free solder‐joint reliability of high‐density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44 min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi‐II Products SPEC have also been reported. Originality/value – Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead‐free soldering. The paper contains some important research results and recommendations.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 11, 2008

Keywords: Solder; Lead; Low temperatures; Packaging processes; Density

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