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Reliability of wirebonds in microelectronic packages

Reliability of wirebonds in microelectronic packages Purpose At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire bondrelated failures are becoming increasingly important. This paper aims to understand these kinds of failures.Designmethodologyapproach Different finite element FE techniques are explored to their ability to describe the thermomechanical behavior of the wire embedded in the electronic package. The developed nonlinear and parametric FE models are able to predict the strong nonlinear behavior of wire failures and multifailure mode interaction accurately and efficiently.Findings It is found that both processing and testing environments as well as the occurrence of delamination strongly increase the risk for wire failures. The results indicate that processing and testing influences are much less than those of the delamination.Practical implications Package designers should focus on limiting the occurrence of delamination around wire bond andor stitch areas.Originalityvalue Combining the strengths of predictive modeling with simulationbased optimization methods, the optimal wire shape is obtained. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Reliability of wirebonds in microelectronic packages

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References (17)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360810875967
Publisher site
See Article on Publisher Site

Abstract

Purpose At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire bondrelated failures are becoming increasingly important. This paper aims to understand these kinds of failures.Designmethodologyapproach Different finite element FE techniques are explored to their ability to describe the thermomechanical behavior of the wire embedded in the electronic package. The developed nonlinear and parametric FE models are able to predict the strong nonlinear behavior of wire failures and multifailure mode interaction accurately and efficiently.Findings It is found that both processing and testing environments as well as the occurrence of delamination strongly increase the risk for wire failures. The results indicate that processing and testing influences are much less than those of the delamination.Practical implications Package designers should focus on limiting the occurrence of delamination around wire bond andor stitch areas.Originalityvalue Combining the strengths of predictive modeling with simulationbased optimization methods, the optimal wire shape is obtained.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 18, 2008

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