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References (5)
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R. Berger (1982)
Guide to Quality ControlJournal of Quality Technology, 14
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A. Tuominen, E. Ristolainen, V. Lehtinen (1999)
Qualification of flip chip fluxes by wetting balance and surface insulation resistance testsSoldering & Surface Mount Technology, 11
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A. Tuominen, A. Perttula (1997)
Testing Flip Chip Reliability By The Four Probe Method In Bypass Diode Connected ChainIEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
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P. Palm, A. Tuominen, Jarmo Maeaettaenen, Liisu Uusitalo (1998)
Reliability, electrical performance, and properties of solder (63/37)-bumped flip-chip components, 3510
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10.1007/978-1-4613-1069-3_1
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360010306038
- Publisher site
- See Article on Publisher Site
Abstract
To achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper reliability of Sn37Pb solder bumped flip chips on an FR5 board, using different fluxes and underfill materials, are tested in a temperature cycling test. Also the contact pad geometry used on the FR5 board had a great influence on the reliability of the joint. The solder bumps were grown on the wellknown TiWAu under bump metallurgy UBM1 with an extra layer of nickel UBM2 which gives a reliable and high performance solder joint.
Journal
Microelectronics International – Emerald Publishing
Published: Apr 1, 2000