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Reliability of flip chip components soldered on FR5 board

Reliability of flip chip components soldered on FR5 board To achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper reliability of Sn37Pb solder bumped flip chips on an FR5 board, using different fluxes and underfill materials, are tested in a temperature cycling test. Also the contact pad geometry used on the FR5 board had a great influence on the reliability of the joint. The solder bumps were grown on the wellknown TiWAu under bump metallurgy UBM1 with an extra layer of nickel UBM2 which gives a reliable and high performance solder joint. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Reliability of flip chip components soldered on FR5 board

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360010306038
Publisher site
See Article on Publisher Site

Abstract

To achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper reliability of Sn37Pb solder bumped flip chips on an FR5 board, using different fluxes and underfill materials, are tested in a temperature cycling test. Also the contact pad geometry used on the FR5 board had a great influence on the reliability of the joint. The solder bumps were grown on the wellknown TiWAu under bump metallurgy UBM1 with an extra layer of nickel UBM2 which gives a reliable and high performance solder joint.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 1, 2000

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