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Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere PurposeThis paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints.Design/methodology/approachThe 01005 capacitors were mounted on OSP-coated pads, and the samples were fabricated in four different atmospheres, i.e. 200 ppm O2/N2, 1,000 ppm O2/N2, 3,000 ppm O2/N2 and air. After the reflow process, visual inspection and X-ray detection were carried out to examine the solder joint shapes and possible defects. Some of the samples fabricated in different conditions were cross-sectioned and the solder joint microstructures were analyzed. On the other hand, besides placing the components on their normal pad positions, a 50 per cent offset of the x-axis (long axis) or y-axis (short axis) was introduced into the chip mounter programs to evaluate the 01005 capacitor’s assembly sensitivity to placement accuracy. The process-induced defects were investigated.FindingsExperimental results indicated that an N2-based protective atmosphere was necessary for 01005 type assembly, as it could obviously improve the 01005 solder joint quality, compared with the air condition. The protective atmosphere had little effect on the appearance, quality and microstructure of solder joints when the oxygen concentration was below 3,000 ppm. But a very low oxygen concentration could increase the risk of tombstoning defects for the assembly process. The N2-based protective atmosphere containing 1,000-2000 ppm O2 was acceptable and appropriate for the assembly of tiny components.Originality/valueThe results of this work provide a set of reflow process parameters and recommendations for 01005 size component assembly in manufacturing. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/SSMT-10-2016-0021
Publisher site
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Abstract

PurposeThis paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints.Design/methodology/approachThe 01005 capacitors were mounted on OSP-coated pads, and the samples were fabricated in four different atmospheres, i.e. 200 ppm O2/N2, 1,000 ppm O2/N2, 3,000 ppm O2/N2 and air. After the reflow process, visual inspection and X-ray detection were carried out to examine the solder joint shapes and possible defects. Some of the samples fabricated in different conditions were cross-sectioned and the solder joint microstructures were analyzed. On the other hand, besides placing the components on their normal pad positions, a 50 per cent offset of the x-axis (long axis) or y-axis (short axis) was introduced into the chip mounter programs to evaluate the 01005 capacitor’s assembly sensitivity to placement accuracy. The process-induced defects were investigated.FindingsExperimental results indicated that an N2-based protective atmosphere was necessary for 01005 type assembly, as it could obviously improve the 01005 solder joint quality, compared with the air condition. The protective atmosphere had little effect on the appearance, quality and microstructure of solder joints when the oxygen concentration was below 3,000 ppm. But a very low oxygen concentration could increase the risk of tombstoning defects for the assembly process. The N2-based protective atmosphere containing 1,000-2000 ppm O2 was acceptable and appropriate for the assembly of tiny components.Originality/valueThe results of this work provide a set of reflow process parameters and recommendations for 01005 size component assembly in manufacturing.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jun 5, 2017

References

  • Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
  • Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders
  • Sn-Ag-Cu soldering reliability as influenced by process atmosphere
  • Effects on nitrogen on wettability and reliability of lead-free solder in reflow soldering
  • An overview of the current status of lead-free assembly and related issues
  • Investigation of reflow soldering under nitrogen atmosphere
  • A study of the initiation of the tombstoning effect on leadless chips
  • Influences of solder wetting on self-alignment accuracy and modeling for optoelectronic devices assembly
  • Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow
  • Optimization of lead free solder 01005 component assembly
  • Voiding mechanism and control in BGA joints with mixed solder alloy system
  • PCB design and assembly process study of 01005 size passive components using lead-free solder
  • Tombstone initiation model for small form-factor surface mount passives
  • Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
  • Process development for 01005 lead-free passive assembly: stencil printing
  • The effect of adventitious oxygen on nitrogen inerted IR reflow soldering with low residue pastes
  • Advances in lead-free electronics soldering
  • Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints
  • Nitrogen influence on the reflow soldering process optimization
  • Effect of voids on the reliability of BGA/CSP solder joints
  • Influence of reflow atmosphere on SAC305 solder joints
  • Thermal impact of solder voids in the electronic packaging of power devices