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Questions concerning the migration to lead‐free solder

Questions concerning the migration to lead‐free solder Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Questions concerning the migration to lead‐free solder

Circuit World , Volume 30 (2): 7 – Jun 1, 2004

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References (18)

Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120410512226
Publisher site
See Article on Publisher Site

Abstract

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.

Journal

Circuit WorldEmerald Publishing

Published: Jun 1, 2004

Keywords: Lead; Solder; Electronic industry

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