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Quantitative Solderability Measurement of Electronic Components

Quantitative Solderability Measurement of Electronic Components The three European Community manufacturers of commercially available wetting balances for measuring the solderability of electronic components have participated in an intercomparison assessment of surfaces of standard solderability that have the potential for calibrating the balance instruments. The development of the standard surfaces, as well as the small adjustments needed to improve the uniformity of design of the different instruments, and the standardisation of the procedures for their use, have been described in the preceding papers in this series. This paper gives details of the experimental procedures used for the intercomparison and the significance of the comparative data from each balance type. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Quantitative Solderability Measurement of Electronic Components

Soldering & Surface Mount Technology , Volume 3 (2): 9 – Feb 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037749
Publisher site
See Article on Publisher Site

Abstract

The three European Community manufacturers of commercially available wetting balances for measuring the solderability of electronic components have participated in an intercomparison assessment of surfaces of standard solderability that have the potential for calibrating the balance instruments. The development of the standard surfaces, as well as the small adjustments needed to improve the uniformity of design of the different instruments, and the standardisation of the procedures for their use, have been described in the preceding papers in this series. This paper gives details of the experimental procedures used for the intercomparison and the significance of the comparative data from each balance type.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Feb 1, 1991

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