Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Quantitative Solderability Measurement of Electronic Components

Quantitative Solderability Measurement of Electronic Components The wetting balance has been identified as a technique suitable for the establishment of a quantitative basis for the measurement of the solderability of electronic components. This paper deals with those parameters of the instrument and those procedures of the measurement that fall within the choice of the operator. It is important to know the amount of attention that must be paid to each parameter to achieve the precision required. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Quantitative Solderability Measurement of Electronic Components

Soldering & Surface Mount Technology , Volume 3 (1): 4 – Jan 1, 1991

Loading next page...
 
/lp/emerald-publishing/quantitative-solderability-measurement-of-electronic-components-FGhQUpEWgn
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037739
Publisher site
See Article on Publisher Site

Abstract

The wetting balance has been identified as a technique suitable for the establishment of a quantitative basis for the measurement of the solderability of electronic components. This paper deals with those parameters of the instrument and those procedures of the measurement that fall within the choice of the operator. It is important to know the amount of attention that must be paid to each parameter to achieve the precision required.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 1991

There are no references for this article.