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Quality Assessment

Quality Assessment 12—Severability Unless surfaces which have to be soldered are prepared properly, incomplete and inadequate soldering will result along with the associated product rejects. Careful and consistent monitoring of PWB and component lead surfaces for adequate solderability is a prerequisite if consistency is to be expected in the soldering phase of board assembly. Simple dip testing of component leads and PWB conductor coupons using the solder and flux combinations to be used in final assembly is usually sufficient for incoming inspection for the PWB assembler. Whereas if significantly long storage periods are foreseen, more severe incoming test parameters should be chosen to allow for degradation of the surfaces to be soldered. Possibly a more mildly active flux might be used for the incoming solder dip testing. It is advisable though, if prolonged storage prior to soldering is anticipated, to protect surfaces to be soldered with coatings conducive to good soldering and protective from environmental contaminants which are detrimental to good solderability. Tin-lead plated or pretinned components leads and tin-lead plated and/or fused PWB's usually provide good insurance toward successful soldering during significantly long storage periods. The following photographs illustrate the appearance of PWB coupons which exhibited varying degrees of solderability upon incoming inspection using a simple solder dip test procedure. The photographs appearing on this page have been contributed by Mr. R. A. Bulwith, Chief Metallographer of Alpha Metals Inc., New Jersey, U.S.A. and due acknowledgement is hereby made to the company for their permission to reproduce this material. Readers are invited to send photographs to that illustrated above, on any aspect of circuit technology, for reproduction op this page. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Quality Assessment

Circuit World , Volume 5 (1): 1 – Apr 1, 1978

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043585
Publisher site
See Article on Publisher Site

Abstract

12—Severability Unless surfaces which have to be soldered are prepared properly, incomplete and inadequate soldering will result along with the associated product rejects. Careful and consistent monitoring of PWB and component lead surfaces for adequate solderability is a prerequisite if consistency is to be expected in the soldering phase of board assembly. Simple dip testing of component leads and PWB conductor coupons using the solder and flux combinations to be used in final assembly is usually sufficient for incoming inspection for the PWB assembler. Whereas if significantly long storage periods are foreseen, more severe incoming test parameters should be chosen to allow for degradation of the surfaces to be soldered. Possibly a more mildly active flux might be used for the incoming solder dip testing. It is advisable though, if prolonged storage prior to soldering is anticipated, to protect surfaces to be soldered with coatings conducive to good soldering and protective from environmental contaminants which are detrimental to good solderability. Tin-lead plated or pretinned components leads and tin-lead plated and/or fused PWB's usually provide good insurance toward successful soldering during significantly long storage periods. The following photographs illustrate the appearance of PWB coupons which exhibited varying degrees of solderability upon incoming inspection using a simple solder dip test procedure. The photographs appearing on this page have been contributed by Mr. R. A. Bulwith, Chief Metallographer of Alpha Metals Inc., New Jersey, U.S.A. and due acknowledgement is hereby made to the company for their permission to reproduce this material. Readers are invited to send photographs to that illustrated above, on any aspect of circuit technology, for reproduction op this page.

Journal

Circuit WorldEmerald Publishing

Published: Apr 1, 1978

There are no references for this article.