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PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System This paper constitutes a followup to earlier work published in Circuit World, Vol. 17, No. 4. The first paper studied the metallographic structures of two commercially available full build electroless copper foils. Part 2 reports the investigations carried out into the etching characteristics of these copper foils, chemically deposited from full build electroless copper baths designated high elongation HE and high strength HS. It is shown that, although attention should be given to the choice of etchant for these copper foils, they do not exhibit an uncontrollable etch rate, as is often feared. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

Cisson, J.; Seigo, J.; Minten, K.
Circuit World , Volume 18 (4): 8 – Mar 1, 1992
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References (1)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046172
Publisher site
See Article on Publisher Site

Abstract

This paper constitutes a followup to earlier work published in Circuit World, Vol. 17, No. 4. The first paper studied the metallographic structures of two commercially available full build electroless copper foils. Part 2 reports the investigations carried out into the etching characteristics of these copper foils, chemically deposited from full build electroless copper baths designated high elongation HE and high strength HS. It is shown that, although attention should be given to the choice of etchant for these copper foils, they do not exhibit an uncontrollable etch rate, as is often feared.

Journal

Circuit World – Emerald Publishing

Published: Mar 1, 1992

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