Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Pretinning and Flux Considerations on the Reliability of Solder Surfaces

Pretinning and Flux Considerations on the Reliability of Solder Surfaces The kinetics of wetting were studied on several different prepared surfaces of copper Cu to simulate the microstructure observed in pretinned Cuclad printed circuit boards. The results illustrate the effectiveness of pretinning in maintaining the solderability of Cu surfaces. Pretinning with Pbrich solder 95Pb5Sn is particularly effective since solderability is preserved even after a relatively long ageing treatment. On the other hand, pretinning with eutectic solder risks the loss of solderability during ageing or baking due to surface exposure of an phase intermetallic with poor wetting properties. The results also confirm the presence of carbon in pretinned specimens due to the use of flux. The effect of carbon on solderability is not yet known. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Pretinning and Flux Considerations on the Reliability of Solder Surfaces

Circuit World , Volume 18 (4): 7 – Mar 1, 1992

Loading next page...
 
/lp/emerald-publishing/pretinning-and-flux-considerations-on-the-reliability-of-solder-nKF5h390Oy

References (11)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046176
Publisher site
See Article on Publisher Site

Abstract

The kinetics of wetting were studied on several different prepared surfaces of copper Cu to simulate the microstructure observed in pretinned Cuclad printed circuit boards. The results illustrate the effectiveness of pretinning in maintaining the solderability of Cu surfaces. Pretinning with Pbrich solder 95Pb5Sn is particularly effective since solderability is preserved even after a relatively long ageing treatment. On the other hand, pretinning with eutectic solder risks the loss of solderability during ageing or baking due to surface exposure of an phase intermetallic with poor wetting properties. The results also confirm the presence of carbon in pretinned specimens due to the use of flux. The effect of carbon on solderability is not yet known.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1992

There are no references for this article.