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Prediction of temperature in silicon chip with nonuniform power a Lagrangian interpolation approach

Prediction of temperature in silicon chip with nonuniform power a Lagrangian interpolation approach This paper describes a generalized method of predicting the temperature distribution of the silicon chip with nonuniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal design was modeled to simulate a typical thermal design of microprocessor. Key thermal design parameters investigated are the heat source placement distance and level of heat dissipation. Verification of the proposed method was carried out by comparing the results with FEA predictions. Results of the verification show that the proposed method is reasonably accurate for practical purposes. A successful attempt has been made to predict the junction temperature of silicon chip with nonuniform power distribution in a simple way. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Prediction of temperature in silicon chip with nonuniform power a Lagrangian interpolation approach

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References (3)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360410531999
Publisher site
See Article on Publisher Site

Abstract

This paper describes a generalized method of predicting the temperature distribution of the silicon chip with nonuniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal design was modeled to simulate a typical thermal design of microprocessor. Key thermal design parameters investigated are the heat source placement distance and level of heat dissipation. Verification of the proposed method was carried out by comparing the results with FEA predictions. Results of the verification show that the proposed method is reasonably accurate for practical purposes. A successful attempt has been made to predict the junction temperature of silicon chip with nonuniform power distribution in a simple way.

Journal

Microelectronics InternationalEmerald Publishing

Published: Aug 1, 2004

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