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Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer... PurposeThe purpose of this work is to form high density interconnection of backboard for press-fit application with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste should be found in order to obtain good electrical and physical performance of conductive paste and avoid the simultaneous curing behavior of prepreg.Design/methodology/approachA novel structure of backboard was designed with using the connection of conductive paste-filled through holes to connect two multilayers. Pre-curing conditions of conductive paste were investigated to find their effects on resistance, bond strength and volume shrinkage. The reliability of pre-curing conductive paste was also analyzed.FindingsPre-curing conditions led to a great influence on the resistance, bond strength and volume shrinkage of conductive paste. The best condition of pre-curing conductive paste was chosen as the low curing temperature of 60 ºC and curing time of 30 min. Cured conductive paste exhibited square resistance of 4.205 mΩ/□ and bonding strength of 22.86 N. As-obtained pre-curing condition could improve the reliability of conductive paste. Pre-curing process of conductive paste at extremely low temperature to interconnect two multilayer structures improved the density interconnection of backboard for press-fit application.Originality/valueThe use of high density interconnection of backboard could lead to good assembly for high-speed signal transmission of electronic products with press-fitting components. The connection of pre-curing conductive paste for multilayers could have important function for improving the application for communication backboard. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

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References (10)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/CW-06-2015-0027
Publisher site
See Article on Publisher Site

Abstract

PurposeThe purpose of this work is to form high density interconnection of backboard for press-fit application with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste should be found in order to obtain good electrical and physical performance of conductive paste and avoid the simultaneous curing behavior of prepreg.Design/methodology/approachA novel structure of backboard was designed with using the connection of conductive paste-filled through holes to connect two multilayers. Pre-curing conditions of conductive paste were investigated to find their effects on resistance, bond strength and volume shrinkage. The reliability of pre-curing conductive paste was also analyzed.FindingsPre-curing conditions led to a great influence on the resistance, bond strength and volume shrinkage of conductive paste. The best condition of pre-curing conductive paste was chosen as the low curing temperature of 60 ºC and curing time of 30 min. Cured conductive paste exhibited square resistance of 4.205 mΩ/□ and bonding strength of 22.86 N. As-obtained pre-curing condition could improve the reliability of conductive paste. Pre-curing process of conductive paste at extremely low temperature to interconnect two multilayer structures improved the density interconnection of backboard for press-fit application.Originality/valueThe use of high density interconnection of backboard could lead to good assembly for high-speed signal transmission of electronic products with press-fitting components. The connection of pre-curing conductive paste for multilayers could have important function for improving the application for communication backboard.

Journal

Circuit WorldEmerald Publishing

Published: Aug 1, 2016

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