Polystrate and Ultrastrate Complementary Multichip Module Technologies

Polystrate and Ultrastrate Complementary Multichip Module Technologies CMOS devices are approaching the 50 MHz threshold at which conventional electronic assembliesbased on packaged components SMD, PGA, etc. mounted on highdensity printed circuit boardsimpose a serious penalty on the speed of the raw die provided by the semiconductor vendors. To improve the packaging density and to reduce the resistive and capacitive loads as well as signal delays at the second level of interconnection, new packaging concepts for VLSI and ULSI components are imperative. Multichip modules MCM seem to be the only adequate solution to the interconnect problem. Ultrastratethe author's company's MCM technology with multilayer thinfilm buildupsis briefly presented. Life cycles for products in the electronics industry are becoming ever shorter. Electronics engineers must package more complicated circuits in smaller volumes and in a shorter time. On the other hand, prototyping an MCM from the electrical schematic takes at least 12 weeks. There is as yet no equivalent of a PCB breadboard for MCMs In response to this situation, Polystrate is a new process which has been developed to provide a flexible and fast prototyping tool for MCMs. It satisfies the most stringent requirements with regard to performance, economics and ease of modification, and offers a very fast turnaround time. The technological synergies between Ultrastrate and Polystrate allow for a smooth transition between the prototyping and production phases. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Polystrate and Ultrastrate Complementary Multichip Module Technologies

Microelectronics International, Volume 8 (2): 6 – Feb 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044445
Publisher site
See Article on Publisher Site

Abstract

CMOS devices are approaching the 50 MHz threshold at which conventional electronic assembliesbased on packaged components SMD, PGA, etc. mounted on highdensity printed circuit boardsimpose a serious penalty on the speed of the raw die provided by the semiconductor vendors. To improve the packaging density and to reduce the resistive and capacitive loads as well as signal delays at the second level of interconnection, new packaging concepts for VLSI and ULSI components are imperative. Multichip modules MCM seem to be the only adequate solution to the interconnect problem. Ultrastratethe author's company's MCM technology with multilayer thinfilm buildupsis briefly presented. Life cycles for products in the electronics industry are becoming ever shorter. Electronics engineers must package more complicated circuits in smaller volumes and in a shorter time. On the other hand, prototyping an MCM from the electrical schematic takes at least 12 weeks. There is as yet no equivalent of a PCB breadboard for MCMs In response to this situation, Polystrate is a new process which has been developed to provide a flexible and fast prototyping tool for MCMs. It satisfies the most stringent requirements with regard to performance, economics and ease of modification, and offers a very fast turnaround time. The technological synergies between Ultrastrate and Polystrate allow for a smooth transition between the prototyping and production phases.

Journal

Microelectronics InternationalEmerald Publishing

Published: Feb 1, 1991

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