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Photonic curing of silver paths on 3D printed polymer substrate

Photonic curing of silver paths on 3D printed polymer substrate Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.Design/methodology/approachThis paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.FindingsThis paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.Originality/valueThe combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Photonic curing of silver paths on 3D printed polymer substrate

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References (47)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0305-6120
DOI
10.1108/cw-11-2018-0084
Publisher site
See Article on Publisher Site

Abstract

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.Design/methodology/approachThis paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.FindingsThis paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.Originality/valueThe combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

Journal

Circuit WorldEmerald Publishing

Published: Jun 7, 2019

Keywords: 3D printing; Additive manufacturing; Photonic curing; Aerosol jet printing; Structural electronics

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