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Photoimageable Screen Printed Soldermasks

Photoimageable Screen Printed Soldermasks Over the last few years, the increase in size of printed circuit boards, together with the increase in density of components, has made successful application of soldermask by conventional screen printing more and more difficult. This is despite improvements in both the screen printing resists and the equipment used. The accuracy produced by the photoimaging technique has been firmly established with the now almost universal use of dryfilm resist for the plating and etching of printed circuit boards. This led to the introduction of the dryfilm soldermask, but, unlike the dryfilm resists used for plating and etching, this type of soldermask has failed to gain universal acceptance, mainly because of technical shortcomings and high costs. The application of liquid soldermasks overcomes many of these technical problems, although the first attempts to achieve acceptable results required special equipment and huge capital investment. Photoimageable soldermasks which can be applied using the conventional printing and exposure equipment, available at printed circuit manufacturers, are now available. Some are processed in aqueous solutions, whilst others are processed in halogenated solvents of the types used in the processing of dryfilm resists. The introduction of such soldermasks makes available the combined advantage of liquid application and photoimaging, which will increase the overall quality of printed circuit boards produced, while utilising existing screen printed, oven, photoexposure unit and conveyorised spray developer. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Photoimageable Screen Printed Soldermasks

Circuit World , Volume 13 (4): 4 – Mar 1, 1987

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043890
Publisher site
See Article on Publisher Site

Abstract

Over the last few years, the increase in size of printed circuit boards, together with the increase in density of components, has made successful application of soldermask by conventional screen printing more and more difficult. This is despite improvements in both the screen printing resists and the equipment used. The accuracy produced by the photoimaging technique has been firmly established with the now almost universal use of dryfilm resist for the plating and etching of printed circuit boards. This led to the introduction of the dryfilm soldermask, but, unlike the dryfilm resists used for plating and etching, this type of soldermask has failed to gain universal acceptance, mainly because of technical shortcomings and high costs. The application of liquid soldermasks overcomes many of these technical problems, although the first attempts to achieve acceptable results required special equipment and huge capital investment. Photoimageable soldermasks which can be applied using the conventional printing and exposure equipment, available at printed circuit manufacturers, are now available. Some are processed in aqueous solutions, whilst others are processed in halogenated solvents of the types used in the processing of dryfilm resists. The introduction of such soldermasks makes available the combined advantage of liquid application and photoimaging, which will increase the overall quality of printed circuit boards produced, while utilising existing screen printed, oven, photoexposure unit and conveyorised spray developer.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1987

There are no references for this article.