Pb‐free solder bumping for flip chip package by electroplating

Pb‐free solder bumping for flip chip package by electroplating Sn‐Pb and Sn‐Ag bumps (130 μ m diameter, 250 μ m pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn‐Pb and Sn‐Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn‐Ag plating thickness was proportional to the current density, while plated Sn‐Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm 2 for 3 h in the case of Sn‐Pb bump plating and 6 A/dm 2 for 1 h for the Sn‐Ag bump plating. The bump shear strength for Sn‐Ag was found to be higher than that of Sn‐Pb. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Pb‐free solder bumping for flip chip package by electroplating

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Publisher
Emerald Publishing
Copyright
Copyright © 2003 MCB UP Ltd. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910310479486
Publisher site
See Article on Publisher Site

Abstract

Sn‐Pb and Sn‐Ag bumps (130 μ m diameter, 250 μ m pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating time on the Sn‐Pb and Sn‐Ag deposits were investigated. The morphology and composition of the plated surface were examined using scanning electron microscopy. The shape and thickness of the solder bumps were also compared. Bump shear testing was performed to measure the adhesion strength between the solder bumps and the under bump metallurgy. In electroplating, the Sn‐Ag plating thickness was proportional to the current density, while plated Sn‐Pb thickness saturated above the limiting current density. The optimal conditions for solder bump fabrication were found at 6 A/dm 2 for 3 h in the case of Sn‐Pb bump plating and 6 A/dm 2 for 1 h for the Sn‐Ag bump plating. The bump shear strength for Sn‐Ag was found to be higher than that of Sn‐Pb.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Aug 1, 2003

Keywords: Flip chip; Lead‐free soldering; Electroplating

References

  • Advances in Electronic Packaging
    Pang, T.Y.; Blair, H.D.; Nicholson, J.M.; Oh, S.W.

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