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Packaging technologies for pressuresensors

Packaging technologies for pressuresensors Pressuresensor miniaturization requires highdensity packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Packaging technologies for pressuresensors

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360210444989
Publisher site
See Article on Publisher Site

Abstract

Pressuresensor miniaturization requires highdensity packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.

Journal

Microelectronics International – Emerald Publishing

Published: Dec 1, 2002

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