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Packages for Highdensity Surfacemount Applications

Packages for Highdensity Surfacemount Applications This paper addresses the various types of surface mounted packages used today for highdensity packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Packages for Highdensity Surfacemount Applications

Circuit World , Volume 13 (3): 4 – Feb 1, 1987

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043881
Publisher site
See Article on Publisher Site

Abstract

This paper addresses the various types of surface mounted packages used today for highdensity packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use.

Journal

Circuit WorldEmerald Publishing

Published: Feb 1, 1987

There are no references for this article.