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Overview of Tape Automated Bonding Technology

Overview of Tape Automated Bonding Technology A review of stateoftheart technology pertinent to tape automated bonding for fine pitch, high IO, high performance, high yield, high volume and high reliability is presented. Emphasis is placed on a new understanding of the key elements for example, tapes, bumps, inner lead bonding, testing and burnin on tapewithchip, encapsulation, outer lead bonding, thermal management, reliability and rework of this rapidly moving technology. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Overview of Tape Automated Bonding Technology

Circuit World , Volume 16 (2): 20 – Jan 1, 1990

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References (60)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb044017
Publisher site
See Article on Publisher Site

Abstract

A review of stateoftheart technology pertinent to tape automated bonding for fine pitch, high IO, high performance, high yield, high volume and high reliability is presented. Emphasis is placed on a new understanding of the key elements for example, tapes, bumps, inner lead bonding, testing and burnin on tapewithchip, encapsulation, outer lead bonding, thermal management, reliability and rework of this rapidly moving technology.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1990

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