Outer Lead Bonding Flatpack SolderingA Precision Soldering Process Demanding High Standards

Outer Lead Bonding Flatpack SolderingA Precision Soldering Process Demanding High Standards Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering process is critical if one does not closely monitor all parameters. This article describes some of the most important parameters of the precision reflow soldering process for TABs and flatpacks. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Outer Lead Bonding Flatpack SolderingA Precision Soldering Process Demanding High Standards

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037761
Publisher site
See Article on Publisher Site

Abstract

Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering process is critical if one does not closely monitor all parameters. This article describes some of the most important parameters of the precision reflow soldering process for TABs and flatpacks.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Mar 1, 1991

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