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Organic Microelectronic Packages Challenges for a PCB Manufacturer

Organic Microelectronic Packages Challenges for a PCB Manufacturer The driving forces behind recent significant improvements in organic packages for microelectronic applications are electrical performance, product weight, size and manufacturing cost. A very careful selection of optimum manufacturing processes, equipment and materials, and stringent control of critical manufacturing operations are prerequisites for success in this emerging market place. Major technical and business related challenges to a printed circuit board manufacturer who plans to enter this market are discussed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Organic Microelectronic Packages Challenges for a PCB Manufacturer

Circuit World , Volume 21 (1): 10 – Apr 1, 1994

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References (1)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046284
Publisher site
See Article on Publisher Site

Abstract

The driving forces behind recent significant improvements in organic packages for microelectronic applications are electrical performance, product weight, size and manufacturing cost. A very careful selection of optimum manufacturing processes, equipment and materials, and stringent control of critical manufacturing operations are prerequisites for success in this emerging market place. Major technical and business related challenges to a printed circuit board manufacturer who plans to enter this market are discussed.

Journal

Circuit WorldEmerald Publishing

Published: Apr 1, 1994

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