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Optimization of fins used in electronic packaging

Optimization of fins used in electronic packaging Purpose To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.Designmethodologyapproach The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms GAs. A range of fin shapes are investigated and the optimum solutions for various profile area are obtained.Findings Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively.Originalityvalue A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.Research limitationsimplications Limited to cases where the correlations for heat transfer coefficients are valid.Practical implications A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360510575495
Publisher site
See Article on Publisher Site

Abstract

Purpose To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.Designmethodologyapproach The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms GAs. A range of fin shapes are investigated and the optimum solutions for various profile area are obtained.Findings Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively.Originalityvalue A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.Research limitationsimplications Limited to cases where the correlations for heat transfer coefficients are valid.Practical implications A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 1, 2005

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