Numerical simulation of heat transfer at the interface of dissimilar materials

Numerical simulation of heat transfer at the interface of dissimilar materials Purpose – The small dimensions of future device designs also imply a stronger effect of material boundary resistance. For nanoscale devices and structures, especially, interface phenomena often dominate their overall thermal behavior. The purpose of this paper is to propose molecular dynamics (MD) simulations to investigate the mechanical and thermal properties at Cu‐Al interface. Design/methodology/approach – The two‐temperature model (TTM)‐MD model is used to describe the electron‐phonon scattering at interface of different metals. Before the simulation of heat transfer process, a non‐ideal Cu‐Al interface is constructed by simulating diffusion bonding. Findings – According to the simulation results, in unsteady state, the temperature distribution and the displacements of atoms near the interface tend to generate stress and voids. It reveals the damage mechanics at the interface in heat transfer. Originality/value – The atomic model proposed in this paper is computationally efficient for interfacial heat transfer problems, and could be used for investigation of other interfacial behaviors of dissimilar materials. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png International Journal of Numerical Methods for Heat & Fluid Flow Emerald Publishing

Numerical simulation of heat transfer at the interface of dissimilar materials

Loading next page...
 
/lp/emerald-publishing/numerical-simulation-of-heat-transfer-at-the-interface-of-dissimilar-tQV70ZuIUA
Publisher
Emerald Publishing
Copyright
Copyright © 2010 Emerald Group Publishing Limited. All rights reserved.
ISSN
0961-5539
DOI
10.1108/09615531011008136
Publisher site
See Article on Publisher Site

Abstract

Purpose – The small dimensions of future device designs also imply a stronger effect of material boundary resistance. For nanoscale devices and structures, especially, interface phenomena often dominate their overall thermal behavior. The purpose of this paper is to propose molecular dynamics (MD) simulations to investigate the mechanical and thermal properties at Cu‐Al interface. Design/methodology/approach – The two‐temperature model (TTM)‐MD model is used to describe the electron‐phonon scattering at interface of different metals. Before the simulation of heat transfer process, a non‐ideal Cu‐Al interface is constructed by simulating diffusion bonding. Findings – According to the simulation results, in unsteady state, the temperature distribution and the displacements of atoms near the interface tend to generate stress and voids. It reveals the damage mechanics at the interface in heat transfer. Originality/value – The atomic model proposed in this paper is computationally efficient for interfacial heat transfer problems, and could be used for investigation of other interfacial behaviors of dissimilar materials.

Journal

International Journal of Numerical Methods for Heat & Fluid FlowEmerald Publishing

Published: Jan 12, 2010

Keywords: Metals; Heat transfer; Thermal resistance; Diffusion; Bonding; Temperature distribution

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create folders to
organize your research

Export folders, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off