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Numerical simulation of electrical engineering devices Magneto‐thermo‐mechanical coupling

Numerical simulation of electrical engineering devices Magneto‐thermo‐mechanical coupling Purpose – The paper seeks to present a methodology of computer simulation of coupled magneto‐thermo‐mechanical processes in various electrical engineering devices. The methodology allows determining their parameters, characteristics and behaviour in various operation regimes. Design/methodology/approach – The mathematical model consisting of three equations describing magnetic field, temperature field and field of mechanical strains and stresses (or thermoelastic displacements) is solved numerically, partially in the hard‐coupled formulation. Findings – The methodology seems to be sufficiently robust, reliable and applicable to a wide spectrum of devices. Research limitations/implications – At this stage of research, the hard‐coupled formulation of thermo‐mechanical (or thermoelastic) problems is still possible only in 2D. Practical implications – The methodology can successfully be used for design of numerous machines, apparatus and devices from the area of low‐frequency electrical engineering ranging from small actuators to large synchronous generators. Originality/value – Complete numerical analysis of coupled magneto‐thermo‐mechanical phenomena in electrical devices. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering Emerald Publishing

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References (8)

Publisher
Emerald Publishing
Copyright
Copyright © 2011 Emerald Group Publishing Limited. All rights reserved.
ISSN
0332-1649
DOI
10.1108/03321641111133127
Publisher site
See Article on Publisher Site

Abstract

Purpose – The paper seeks to present a methodology of computer simulation of coupled magneto‐thermo‐mechanical processes in various electrical engineering devices. The methodology allows determining their parameters, characteristics and behaviour in various operation regimes. Design/methodology/approach – The mathematical model consisting of three equations describing magnetic field, temperature field and field of mechanical strains and stresses (or thermoelastic displacements) is solved numerically, partially in the hard‐coupled formulation. Findings – The methodology seems to be sufficiently robust, reliable and applicable to a wide spectrum of devices. Research limitations/implications – At this stage of research, the hard‐coupled formulation of thermo‐mechanical (or thermoelastic) problems is still possible only in 2D. Practical implications – The methodology can successfully be used for design of numerous machines, apparatus and devices from the area of low‐frequency electrical engineering ranging from small actuators to large synchronous generators. Originality/value – Complete numerical analysis of coupled magneto‐thermo‐mechanical phenomena in electrical devices.

Journal

COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic EngineeringEmerald Publishing

Published: Jul 12, 2011

Keywords: Numerical analysis; Finite element analysis

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