Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on... The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing.Design/methodology/approachA finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma’aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s.FindingsNoteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma’aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds.Originality/valueParameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma’aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Download PDF
5 pages

Loading next page...
 
/lp/emerald-publishing/numerical-investigation-on-the-effect-of-solder-paste-rheological-2FPhsM86jE

References (19)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
DOI
10.1108/ssmt-11-2019-0037
Publisher site
See Article on Publisher Site

Abstract

The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing.Design/methodology/approachA finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma’aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s.FindingsNoteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma’aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds.Originality/valueParameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma’aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Aug 23, 2020

Keywords: Stencil printing; Numerical modelling; Non-Newtonian material models; Suspension rheology

There are no references for this article.