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New products

New products 'Wave' Coating Machine Precision Flip Chip Assembly Systems The wave coating machine, developed and manufactured by Robnorganic Micro Robotics Systems announce its entry into the flip chip assembly market with the introduction of a line of precision assembly systems. This Systems for the hybrid electronic circuit market, has been designed to apply new generation of equipment includes both vision-guided fully automatic a protective coating of resin to one side of DIL-circuits. Operation of this machine is carried out by loading the DILs onto spring- and low cost manual versions. loaded clips mounted on a carrier assembly which travels across the wave The MRSI-503 Fully Automatic Flip Chip Assembly System is designed by a variable speed, oil controlled, pneumatic drive. Flow of coating material for a high speed production environment. Using a two wristed robot, each from the tank aperture is adjustable to provide precise control of wave with its own optics and pick-up tools, the system can be optimised for any height. Essential design features include stainless steel construction, all application. One of two downward facing cameras is used to automatically pneumatic controls eliminating any danger of flame hazard and a tank of recognise the top periphery of flip chip devices. Alternatively, the system the recirculating type which maintains the dipping material in a perfectly can use the downward facing cameras to recognise randomly oriented dies mixed condition. This is easily removed for cleaning purposes from the for wire bonding applications. rear of the machine. After the die is picked up by the robot, an upward facing camera Depending upon the choice of coating material used, a solvent reservoir automatically vision-aligns the bottom features of the die, i.e., solder bumps. with metering valve can be mounted on top of the machine enabling solvent The substrate periphery and pattern are automatically vision-aligned prior to be fed to the circulating resin to maintain the required viscosity. to die placement, resulting in a placement accuracy of ±0·0015 in. or better. Depending on size of component, speed of operation and desired thickness The system is ideally suited for flip chip, beam-leaded devices, hybrid, of coating, throughput can be in the order of 5/6,000 pieces per day. microwave and multichip modules. The upward facing camera can even Robnorganic Systems Ltd, Highworth Road, South Marston, Swindon, be used to locate bottom vias on GaAs devices. This results in very precise Wiltshire. SN3 4TE. Telephone: (0793) 823741. Telex: 449905. Fax: (0793) placements, which are extremely important for microwave applications. 823741. The MRSI-503 is available with a full range of input options including waffle packs, Gel packs, tape feeder, expanded wafer and vibrator feeders. The system is available with automatic cassette-to-cassette output. Desk Top Laser Trimmer The MRSI-503M Precision Manual Flip Chip Assembly System has been designed for low volume prototype production. The system's unique design Munich laser systems has just released a new generation of laser trimmers, makes viewing, alignment and bonding both fast and accurate. The low the Desk Top Laser Trimmer for hybrid and SMD applications. Of the cost system is available with a variety of options which allow it to be used various methods of trimming thin and thick film resistors, laser trimming in any flip chip fabrication process. is by far the most popular and the most practical. Until now it has involved an investment in excess of $100,000 for a system that occupies a large floor Micro Robotics Systems, Inc., 25 Industrial Avenue, Chelmsford, area, requires a 3 phase power supply, uses high volumes of water for cooling MA 01824. Telephone: (508) 256-4950. Fax: (508) 256-5120. and has only been suitable for unpopulated substrates. The mls 320 and 320G have changed all that. For less than half the price of more conventional trimmers mls offers a system that occupies an area less than 5 sq ft, requires only a 13 amp , 240 v outlet, is air cooled and Cadmium-free Glass Encapsulant for Hybrid Circuits has no consumable parts (such as flashlamp and deioniser resin) to be replaced. It is also far more flexible than its 'big brothers' as it can Du Pont Electronics has introduced a new, cadmium-free glass accommodate populated PCBs and assemblies as well as hybrid substrates. encapsulant, which forms a smooth, dense insulating and protective layer This means that circuits can now be fine tuned by trimming a resistor over ceramic hybrid circuits and resistor networks. (thick film, passivated thin film or SMT) in situ without the use of selected Known as QQ 550, the new glass overglaze is compatible with the resistors or potentiometers. The range of applications is vast—parameters company's range of thick film resistor compositions, as well as with its range of conductor and dielectric pastes. It also forms part of the such as input sensitivity, amplification ratio, output frequency, switching 'Series Q ' family of materials. thresholds, characteristic curve shapes, etc., can be trimmed to various values and tolerances. The advantages afforded by this trimming process QQ 550 is air-fireable in a belt furnace for 20-25 minutes, with a peak are design flexibility, smaller components and lower associated costs as temperature of 500-510°C, and provides good long-term reliability of laser- well as a broader range of products. trimmed resistors. Being less porous than many other glass encapsulants, it gives improved Masic Europe, UK Office, 2-12 Whitchurch Road, Pangbourne, Reading protection against humidity, and increased resistance to the migration of RG8 7BP. Telephone: (0734) 833347. Fax: (0734) 845396. silver-bearing conductors. Du Pont de Nemours International S.A., P.O. Box 50, 2, chemin du Solder Paste Pavilion, CH-1218 Le Grand Saconnex, Geneva, Switzerland. Telephone: A new solder paste from Fry's Metals offers unrivalled performance for (022) 717 52 54. Telex: 415 777 dupch. surface mounting and hybrid assembly. Flowcream MicroTrak was developed especially to meet stringent needs in surface mount and hybrid technologies. Modern assembly designs call for very fine conductor widths and close pad spacing, which are highly General Purpose Silver-Palladium Conductor Paste demanding of solder paste performance. MicroTrak uses Fry's widely acclaimed 'oxide free' solder powder, and Heraprint C 1214 EC is a silver-palladium (3:1) high conductivity, general a state-of-the-art flux vehicle, to produce consistent printing and predictable purpose conductor paste recently introduced into the market by Heraeus. reflow performance. It has good tackiness properties, excellent slump The presence of palladium reduces the migration of silver ions and resistance and extended screen life. improves the leach resistance. Even after multiple firings it shows extraordinarily high adhesion characteristics. The flux produces barely discernible residues which need not be removed from assemblies after reflow. However, if required, assemblies can be C 1214 EC can be easily soldered on to alumina and to the dielectric cleaned using either fluorocarbon solvents or saponifier-based aqueous Heramic IP 9117. Its Theological properties make it suitable for both fine cleaning systems. line and surface printing, the line definition achieved being 125 μm at a printing speed of 30 cm/s . Various grades are available to suit screen and stencil printing, with C 1214 EC is compatible with all Heraprint and Cermalloy resistor and powder sizes from 20-45 micron and melting points from 183-290°C. Fry's Metals Ltd., Tandem House, Marlowe Way, Beddington Farm Road, conductor paste products of Heraeus. Croydon CR9 4BT. Telephone: 081-665 6666. Telex: 265732. Fax: 081-665 W.C. Heraeus GmbH, Produktbereiech Dickfilm, Postfach 1553, D-6450 Hanau 1, Germany. Telephone: +49-6181-35-5466. Fax: +49-6181-35-786. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

New products

Microelectronics International , Volume 8 (3): 1 – Mar 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044461
Publisher site
See Article on Publisher Site

Abstract

'Wave' Coating Machine Precision Flip Chip Assembly Systems The wave coating machine, developed and manufactured by Robnorganic Micro Robotics Systems announce its entry into the flip chip assembly market with the introduction of a line of precision assembly systems. This Systems for the hybrid electronic circuit market, has been designed to apply new generation of equipment includes both vision-guided fully automatic a protective coating of resin to one side of DIL-circuits. Operation of this machine is carried out by loading the DILs onto spring- and low cost manual versions. loaded clips mounted on a carrier assembly which travels across the wave The MRSI-503 Fully Automatic Flip Chip Assembly System is designed by a variable speed, oil controlled, pneumatic drive. Flow of coating material for a high speed production environment. Using a two wristed robot, each from the tank aperture is adjustable to provide precise control of wave with its own optics and pick-up tools, the system can be optimised for any height. Essential design features include stainless steel construction, all application. One of two downward facing cameras is used to automatically pneumatic controls eliminating any danger of flame hazard and a tank of recognise the top periphery of flip chip devices. Alternatively, the system the recirculating type which maintains the dipping material in a perfectly can use the downward facing cameras to recognise randomly oriented dies mixed condition. This is easily removed for cleaning purposes from the for wire bonding applications. rear of the machine. After the die is picked up by the robot, an upward facing camera Depending upon the choice of coating material used, a solvent reservoir automatically vision-aligns the bottom features of the die, i.e., solder bumps. with metering valve can be mounted on top of the machine enabling solvent The substrate periphery and pattern are automatically vision-aligned prior to be fed to the circulating resin to maintain the required viscosity. to die placement, resulting in a placement accuracy of ±0·0015 in. or better. Depending on size of component, speed of operation and desired thickness The system is ideally suited for flip chip, beam-leaded devices, hybrid, of coating, throughput can be in the order of 5/6,000 pieces per day. microwave and multichip modules. The upward facing camera can even Robnorganic Systems Ltd, Highworth Road, South Marston, Swindon, be used to locate bottom vias on GaAs devices. This results in very precise Wiltshire. SN3 4TE. Telephone: (0793) 823741. Telex: 449905. Fax: (0793) placements, which are extremely important for microwave applications. 823741. The MRSI-503 is available with a full range of input options including waffle packs, Gel packs, tape feeder, expanded wafer and vibrator feeders. The system is available with automatic cassette-to-cassette output. Desk Top Laser Trimmer The MRSI-503M Precision Manual Flip Chip Assembly System has been designed for low volume prototype production. The system's unique design Munich laser systems has just released a new generation of laser trimmers, makes viewing, alignment and bonding both fast and accurate. The low the Desk Top Laser Trimmer for hybrid and SMD applications. Of the cost system is available with a variety of options which allow it to be used various methods of trimming thin and thick film resistors, laser trimming in any flip chip fabrication process. is by far the most popular and the most practical. Until now it has involved an investment in excess of $100,000 for a system that occupies a large floor Micro Robotics Systems, Inc., 25 Industrial Avenue, Chelmsford, area, requires a 3 phase power supply, uses high volumes of water for cooling MA 01824. Telephone: (508) 256-4950. Fax: (508) 256-5120. and has only been suitable for unpopulated substrates. The mls 320 and 320G have changed all that. For less than half the price of more conventional trimmers mls offers a system that occupies an area less than 5 sq ft, requires only a 13 amp , 240 v outlet, is air cooled and Cadmium-free Glass Encapsulant for Hybrid Circuits has no consumable parts (such as flashlamp and deioniser resin) to be replaced. It is also far more flexible than its 'big brothers' as it can Du Pont Electronics has introduced a new, cadmium-free glass accommodate populated PCBs and assemblies as well as hybrid substrates. encapsulant, which forms a smooth, dense insulating and protective layer This means that circuits can now be fine tuned by trimming a resistor over ceramic hybrid circuits and resistor networks. (thick film, passivated thin film or SMT) in situ without the use of selected Known as QQ 550, the new glass overglaze is compatible with the resistors or potentiometers. The range of applications is vast—parameters company's range of thick film resistor compositions, as well as with its range of conductor and dielectric pastes. It also forms part of the such as input sensitivity, amplification ratio, output frequency, switching 'Series Q ' family of materials. thresholds, characteristic curve shapes, etc., can be trimmed to various values and tolerances. The advantages afforded by this trimming process QQ 550 is air-fireable in a belt furnace for 20-25 minutes, with a peak are design flexibility, smaller components and lower associated costs as temperature of 500-510°C, and provides good long-term reliability of laser- well as a broader range of products. trimmed resistors. Being less porous than many other glass encapsulants, it gives improved Masic Europe, UK Office, 2-12 Whitchurch Road, Pangbourne, Reading protection against humidity, and increased resistance to the migration of RG8 7BP. Telephone: (0734) 833347. Fax: (0734) 845396. silver-bearing conductors. Du Pont de Nemours International S.A., P.O. Box 50, 2, chemin du Solder Paste Pavilion, CH-1218 Le Grand Saconnex, Geneva, Switzerland. Telephone: A new solder paste from Fry's Metals offers unrivalled performance for (022) 717 52 54. Telex: 415 777 dupch. surface mounting and hybrid assembly. Flowcream MicroTrak was developed especially to meet stringent needs in surface mount and hybrid technologies. Modern assembly designs call for very fine conductor widths and close pad spacing, which are highly General Purpose Silver-Palladium Conductor Paste demanding of solder paste performance. MicroTrak uses Fry's widely acclaimed 'oxide free' solder powder, and Heraprint C 1214 EC is a silver-palladium (3:1) high conductivity, general a state-of-the-art flux vehicle, to produce consistent printing and predictable purpose conductor paste recently introduced into the market by Heraeus. reflow performance. It has good tackiness properties, excellent slump The presence of palladium reduces the migration of silver ions and resistance and extended screen life. improves the leach resistance. Even after multiple firings it shows extraordinarily high adhesion characteristics. The flux produces barely discernible residues which need not be removed from assemblies after reflow. However, if required, assemblies can be C 1214 EC can be easily soldered on to alumina and to the dielectric cleaned using either fluorocarbon solvents or saponifier-based aqueous Heramic IP 9117. Its Theological properties make it suitable for both fine cleaning systems. line and surface printing, the line definition achieved being 125 μm at a printing speed of 30 cm/s . Various grades are available to suit screen and stencil printing, with C 1214 EC is compatible with all Heraprint and Cermalloy resistor and powder sizes from 20-45 micron and melting points from 183-290°C. Fry's Metals Ltd., Tandem House, Marlowe Way, Beddington Farm Road, conductor paste products of Heraeus. Croydon CR9 4BT. Telephone: 081-665 6666. Telex: 265732. Fax: 081-665 W.C. Heraeus GmbH, Produktbereiech Dickfilm, Postfach 1553, D-6450 Hanau 1, Germany. Telephone: +49-6181-35-5466. Fax: +49-6181-35-786.

Journal

Microelectronics InternationalEmerald Publishing

Published: Mar 1, 1991

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