New products

New products Solar Cell Printing and Handling System Production Wriststrap Tester DEK Printing Machines have developed a number of systems for To enable the continuity of production personnel's wriststraps to be printing solar cells. In the case of one system for installation in India, it monitored, a UK designed bench mounted test unit has been developed, was specified that the substrate feed should be capable of handling three measuring 5 in. × 2·25 in.× 1 in. configurations of 100 × 100 mm substrates: square, circular, and circular Powered by a PP3 9 volt battery, the S510 enables wriststrap overall with a flat. resistance to be readily checked by means of green/red LED displays, The Model 1242 multicassette unloader takes up to 8 cassette carriers which registers a PASS/FAIL based on 5 Mohm limits in the standard giving 600 wafer capacity; these are unloaded by a vacuum pickoff head model. operating on the underside and transferred to tin conveyor belts. These The unit measures the overall resistance of the operator and wriststrap transport them to a rising platen nest where registration is carried out by in series, when the operator plugs the wriststrap into a socket adaptor and vacuum heads against stops. Registration accuracy with the Model 1760 touches the contact plate thick film printer is ± 20 microns. Surrey Electro-Materials Ltd, Surrey House, London Road, Staines, After printing, the substrates go by twin conveyor to a collocator. This Middlesex TW18 4HN. Telephone: (0784) 61393. is a cradle type which lifts them by their underside edges only onto a Model 1209 high speed dryer. They are taken off the dryer belt by a SMT and Hybrid Reflow Soldering System Model 3972 which transfers them to a multicassette reloader. Feeding of the cassettes along the racks for unloading and reloading is automatic, Sikama International have introduced a new 3 heat zone Reflow with visual and audio warning signals for the operator when the racks Soldering System designated Falcon Eight. This beltless in-line unit need replenishing. utilises a concept where the substrate is in direct contact with the heating The circular substrates need pre-alignment before registration. A built- and cooling platens to provide fast and positive solder bonds. The System in alignment station sets their position first by centralising rollers, then by accepts substrate material of ceramic, glass/epoxy and porcelainised a stepper motor which rotates them under the control of optical sensors. metals, and will process substrates up to 8 x 11 inches. When correctly aligned, they are transferred to the registration nest and Five heat zones can be customised and run parts in-line in either printed. direction. Digital display controllers maintain temperatures at ±2°C and are placed in front for operator safety. An optional computer with micro DEK Printing Machines Ltd., 22 Albany Road, Granby Industrial Estate, cassette provides storage of temperature profiles and direct readout on Weymouth, Dorset DT4 9TH. Telephone: (030 57) 74431. Telex: 41122. LCD; it also runs hard copy print out on status of systems at regular intervals. Custom Thick Film Substrates for Use to 5 GHz DEK Printing Machines Ltd, 22 Albany Road, Granby Industrial Estate, KDI Electronics are now offering custom thick film microwave Weymouth, Dorset DT4 9TH. Telephone: (030 57) 74431. Telex: 41122. substrates for product performance at specified frequencies from DC to 5· 0 GHz. Thermocompression Ball Bonder The use of thick film screen and fire techniques provides a cost effective Kulicke & Soffa have introduced the model 4128 all-purpose means of fabricating high reliability microwave integrated circuits. The products available include fixed value attenuators in chip, SMA thermocompression gold wire manual ball bonder for hybrids, microwave and TO-5 packages; digital attenuators in pin packages or surface devices, discrete devices, laser diode applications and optoelectronic mounting chip configurations; relay switched (TO-5) attenuators and R-C devices. circuits for microwave oscillators. The 4128 is versatile enough to bond devices or complex hybrids with Various metallisations are available including gold, platinum gold, height variations up to 300 mils, with a wire diameter range of 0·7 to palladium silver and platinum palladium silver. These can also be 2· 0 mil (18 to 50·8 microns). intermixed allowing the fabrication of substrates which are Important design features incorporated into the 4128 are: simultaneously solderable, wirebondable and diebondable. DC Servo Linear Variable-Differential Transformer (LVDT) controlled The thick film resistive portions can be resistors or attenuators in displacement system providing maximum repeatability; built-in electronic lumped or distributed configurations. Computerised laser calibration flame-off with ball size adjusting dial; adjustable buzzer for bonding head vibration amplitude control; controlled-impact bonding head provides accuracies to 0·1 dB. minimising vibration and producing high quality bonds with better Aspen Electronics Ltd, 1-3 Kildare Close, Eastcote, Ruislip, Middlesex uniformity of wire deformation; stitch bonding capability, and a heated HA4 9UR. Telephone: (01) 868 1311. Telex: 8812727. Fax: 01 866 6596. tool holder with closed loop temperature controller. Kulicke & Soffa (UK) Ltd, Denton Island, Newhaven, East Sussex BN9 9BA. Laboratory' Tube Furnace Telephone (0273) 513111. A new, versatile Laboratory Tube Furnace that is highly reliable as well as energy-efficient at temperatures up to 1700°C has been introduced by New Polymer System Lindberg, a Unit of General Signal, Watertown, Wisconsin. Heraeus offers a new line of polymer thick film inks for the membrane The 1700°C horizontal tube furnace is responsive and reliable for switch, chip component, PCB (multilayer or solder mask cover coat) and operation through the radiant temperature range. For example, the semiconductor die and component attach industries. chamber's 12 in. long heated length provides a temperature profile of plus or minus one degree at 1700°C setpoint for its centre 5¼ in. Conductors, dielectrics and resistors with extreme flexibility are produced for the membrane switch market. Solderable and plateable The unit's excellent temperature uniformity and thermal efficiency are polymer conductors with excellent adhesion to alumina on PCB are achieved by combining an innovative heating element of long life offered for chip component end termination and low cost interconnection molybdenum disilicide with a very low-maintenance, graded ceramic fibre applications. Compatible dielectrics and solder masks offering superior insulation system. moisture resistance and capable of withstanding soldering temperatures To expand its capabilities, the chamber vestibule is bored to accept a up to 260°C are also available. 3 in. OD process tube. Optional interchangeable end vestibules allow use of 1 in. and 2 in. OD process tubes. The Heraeus range of polymer thick film is completed by a system of Precise tube furnace operation is provided by a highly accurate control resistors for use in potentiometers on PTF circuitry for either flexible or console. A three-mode, digital-display temperature control instrument rigid applications. maintains desired temperature and indicates the set point plus chamber Extensive application literature is offered on the Heraeus polymer and deviation temperatures. The system includes over-temperature products, detailed printing and processing instructors, plating and soldering methods, infra-red profiles and resistor stability. Data are protection circuitry. A programmable controller is also available as an available on request. option. BLUE M, a Unit of General Signal, Kingswick House, Kingswick Drive, Heraeus Silica & Metals Ltd, 120 Oyster Lane, Byfleet, Weybridge, Surrey KT14 7LE. Telephone: (093 23) 49315. Telex: 928497. Sunninghill, Berks. SL5 7BJ. Telephone: (0990) 23491. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

New products

Microelectronics International, Volume 3 (2): 1 – Feb 1, 1986

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044237
Publisher site
See Article on Publisher Site

Abstract

Solar Cell Printing and Handling System Production Wriststrap Tester DEK Printing Machines have developed a number of systems for To enable the continuity of production personnel's wriststraps to be printing solar cells. In the case of one system for installation in India, it monitored, a UK designed bench mounted test unit has been developed, was specified that the substrate feed should be capable of handling three measuring 5 in. × 2·25 in.× 1 in. configurations of 100 × 100 mm substrates: square, circular, and circular Powered by a PP3 9 volt battery, the S510 enables wriststrap overall with a flat. resistance to be readily checked by means of green/red LED displays, The Model 1242 multicassette unloader takes up to 8 cassette carriers which registers a PASS/FAIL based on 5 Mohm limits in the standard giving 600 wafer capacity; these are unloaded by a vacuum pickoff head model. operating on the underside and transferred to tin conveyor belts. These The unit measures the overall resistance of the operator and wriststrap transport them to a rising platen nest where registration is carried out by in series, when the operator plugs the wriststrap into a socket adaptor and vacuum heads against stops. Registration accuracy with the Model 1760 touches the contact plate thick film printer is ± 20 microns. Surrey Electro-Materials Ltd, Surrey House, London Road, Staines, After printing, the substrates go by twin conveyor to a collocator. This Middlesex TW18 4HN. Telephone: (0784) 61393. is a cradle type which lifts them by their underside edges only onto a Model 1209 high speed dryer. They are taken off the dryer belt by a SMT and Hybrid Reflow Soldering System Model 3972 which transfers them to a multicassette reloader. Feeding of the cassettes along the racks for unloading and reloading is automatic, Sikama International have introduced a new 3 heat zone Reflow with visual and audio warning signals for the operator when the racks Soldering System designated Falcon Eight. This beltless in-line unit need replenishing. utilises a concept where the substrate is in direct contact with the heating The circular substrates need pre-alignment before registration. A built- and cooling platens to provide fast and positive solder bonds. The System in alignment station sets their position first by centralising rollers, then by accepts substrate material of ceramic, glass/epoxy and porcelainised a stepper motor which rotates them under the control of optical sensors. metals, and will process substrates up to 8 x 11 inches. When correctly aligned, they are transferred to the registration nest and Five heat zones can be customised and run parts in-line in either printed. direction. Digital display controllers maintain temperatures at ±2°C and are placed in front for operator safety. An optional computer with micro DEK Printing Machines Ltd., 22 Albany Road, Granby Industrial Estate, cassette provides storage of temperature profiles and direct readout on Weymouth, Dorset DT4 9TH. Telephone: (030 57) 74431. Telex: 41122. LCD; it also runs hard copy print out on status of systems at regular intervals. Custom Thick Film Substrates for Use to 5 GHz DEK Printing Machines Ltd, 22 Albany Road, Granby Industrial Estate, KDI Electronics are now offering custom thick film microwave Weymouth, Dorset DT4 9TH. Telephone: (030 57) 74431. Telex: 41122. substrates for product performance at specified frequencies from DC to 5· 0 GHz. Thermocompression Ball Bonder The use of thick film screen and fire techniques provides a cost effective Kulicke & Soffa have introduced the model 4128 all-purpose means of fabricating high reliability microwave integrated circuits. The products available include fixed value attenuators in chip, SMA thermocompression gold wire manual ball bonder for hybrids, microwave and TO-5 packages; digital attenuators in pin packages or surface devices, discrete devices, laser diode applications and optoelectronic mounting chip configurations; relay switched (TO-5) attenuators and R-C devices. circuits for microwave oscillators. The 4128 is versatile enough to bond devices or complex hybrids with Various metallisations are available including gold, platinum gold, height variations up to 300 mils, with a wire diameter range of 0·7 to palladium silver and platinum palladium silver. These can also be 2· 0 mil (18 to 50·8 microns). intermixed allowing the fabrication of substrates which are Important design features incorporated into the 4128 are: simultaneously solderable, wirebondable and diebondable. DC Servo Linear Variable-Differential Transformer (LVDT) controlled The thick film resistive portions can be resistors or attenuators in displacement system providing maximum repeatability; built-in electronic lumped or distributed configurations. Computerised laser calibration flame-off with ball size adjusting dial; adjustable buzzer for bonding head vibration amplitude control; controlled-impact bonding head provides accuracies to 0·1 dB. minimising vibration and producing high quality bonds with better Aspen Electronics Ltd, 1-3 Kildare Close, Eastcote, Ruislip, Middlesex uniformity of wire deformation; stitch bonding capability, and a heated HA4 9UR. Telephone: (01) 868 1311. Telex: 8812727. Fax: 01 866 6596. tool holder with closed loop temperature controller. Kulicke & Soffa (UK) Ltd, Denton Island, Newhaven, East Sussex BN9 9BA. Laboratory' Tube Furnace Telephone (0273) 513111. A new, versatile Laboratory Tube Furnace that is highly reliable as well as energy-efficient at temperatures up to 1700°C has been introduced by New Polymer System Lindberg, a Unit of General Signal, Watertown, Wisconsin. Heraeus offers a new line of polymer thick film inks for the membrane The 1700°C horizontal tube furnace is responsive and reliable for switch, chip component, PCB (multilayer or solder mask cover coat) and operation through the radiant temperature range. For example, the semiconductor die and component attach industries. chamber's 12 in. long heated length provides a temperature profile of plus or minus one degree at 1700°C setpoint for its centre 5¼ in. Conductors, dielectrics and resistors with extreme flexibility are produced for the membrane switch market. Solderable and plateable The unit's excellent temperature uniformity and thermal efficiency are polymer conductors with excellent adhesion to alumina on PCB are achieved by combining an innovative heating element of long life offered for chip component end termination and low cost interconnection molybdenum disilicide with a very low-maintenance, graded ceramic fibre applications. Compatible dielectrics and solder masks offering superior insulation system. moisture resistance and capable of withstanding soldering temperatures To expand its capabilities, the chamber vestibule is bored to accept a up to 260°C are also available. 3 in. OD process tube. Optional interchangeable end vestibules allow use of 1 in. and 2 in. OD process tubes. The Heraeus range of polymer thick film is completed by a system of Precise tube furnace operation is provided by a highly accurate control resistors for use in potentiometers on PTF circuitry for either flexible or console. A three-mode, digital-display temperature control instrument rigid applications. maintains desired temperature and indicates the set point plus chamber Extensive application literature is offered on the Heraeus polymer and deviation temperatures. The system includes over-temperature products, detailed printing and processing instructors, plating and soldering methods, infra-red profiles and resistor stability. Data are protection circuitry. A programmable controller is also available as an available on request. option. BLUE M, a Unit of General Signal, Kingswick House, Kingswick Drive, Heraeus Silica & Metals Ltd, 120 Oyster Lane, Byfleet, Weybridge, Surrey KT14 7LE. Telephone: (093 23) 49315. Telex: 928497. Sunninghill, Berks. SL5 7BJ. Telephone: (0990) 23491.

Journal

Microelectronics InternationalEmerald Publishing

Published: Feb 1, 1986

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