Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. 18 in. to 4 in. 4 in. and assembling a wide range of components from 0402 chips to 52pin PLCCs. Its contactfree, vision centring system, featuring 64 level greyscale processing, permits placement of components to 0787 in. with 20 mil lead spacing.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Mar 1, 1991