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New Products

New Products Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. 18 in. to 4 in. 4 in. and assembling a wide range of components from 0402 chips to 52pin PLCCs. Its contactfree, vision centring system, featuring 64 level greyscale processing, permits placement of components to 0787 in. with 20 mil lead spacing. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037771
Publisher site
See Article on Publisher Site

Abstract

Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. 18 in. to 4 in. 4 in. and assembling a wide range of components from 0402 chips to 52pin PLCCs. Its contactfree, vision centring system, featuring 64 level greyscale processing, permits placement of components to 0787 in. with 20 mil lead spacing.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Mar 1, 1991

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