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New products

New products A new high precision reflow solderingbonding machine, the Farco F130, ideal for automatically placing and accurately soldering surface mount devices such as flatpacks, chip carriers, SO and VSO components is available from Dage. TAB Tape Automated Bonding components can also be processed using the F130's modular system design which allows the machine to be more versatile in application. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

New products

Microelectronics International , Volume 4 (2): 3 – Feb 1, 1987
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044283
Publisher site
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Abstract

A new high precision reflow solderingbonding machine, the Farco F130, ideal for automatically placing and accurately soldering surface mount devices such as flatpacks, chip carriers, SO and VSO components is available from Dage. TAB Tape Automated Bonding components can also be processed using the F130's modular system design which allows the machine to be more versatile in application.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1987

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