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New products

New products AugatIsotronics now offer injection moulded, glasstometal sealed hybrid circuit packages providing many advantages over conventional machined components. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

New products

Microelectronics International , Volume 5 (2): 4 – Feb 1, 1988
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044330
Publisher site
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Abstract

AugatIsotronics now offer injection moulded, glasstometal sealed hybrid circuit packages providing many advantages over conventional machined components.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1988

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