Through-plating Without the Use of Electroless Copper of the phototool and further improves the quality and consistency of the transferred image. A through-plating facility designed by Heraeus eliminates the need for The Riston PC300 exposure unit has successfully completed an extensive electroless copper. The new compact facility, which can handle printed testing programme and is expected to be available commercially at the end circuit boards measuring up to 250 x 450 mm, is easy to operate and causes of 1991. no damage to the environment. In spite of dispensing with electroless copper, Du Pont de Nemours International S.A., PO Box 50, 2 chemin du Pavillon, complexing agents and formaldehyde, a high degree of quality in the CH-1218 Le Grande-Saconnex/Geneva. Telephone: (022) 7175254. Telex: through-plating of drilled holes is achieved. 415 777 dupch. Fax: (022) 717 60 21. In the production of through-plated circuit boards, one step in the process is particularly critical—electroless copper. It contains copper, complexing agents and formaldehyde—substances which are extremely hazardous to the environment and which create grave problems with regard to the Solder Fumes Cause Health Risks treatment of waste water. In the new laboratory facility type DK1 developed Tip-X-Traction is an effective low cost method of reducing the risk of by Heraeus, chemical copper is replaced by a special bath, in which the solder fume inhalation. A small Fume-X-Traction tip is fitted to the heated printed circuit boards are vertically suspended and pre-metallised. A thin end of the soldering iron. The extraction tip is linked to an extraction palladium film acts as a catalyst, renders the hole surface conductive and manifold via lightweight flexible tubing. The extracted solder fumes pass activates the surface for the subsequent plating process. through the extraction manifold to a central exhauster filter unit. Housed The special bath does not contain any complexing agents and is more inside are specially designed filters which capture the harmful fumes before resistant, a fact which significantly reduces the time spent on analysis. The returning the cleaned air to the workplace. easy to operate through-plating facility type DK1 was designed specially The new Pace Fume-X-Tractor Tip-100 is a medium size system which for use by institutes, laboratories, and manufacturers for small batch will provide sufficient extraction for up to 100 soldering irons. The unique production. It enables sample boards to be produced easily. The possibility design of the motor pump ensures that long duct runs present no problems. of immediate production of boards significantly reduces development times. Pace Europe, 16 Plover Close, Interchange Park, Newport Pagnell, Bucks Due to its modular structure, the facility can be extended at a later stage MK16 9PS. Telephone: (0908) 211222. Fax: (0908) 210050. without any problems. The acquisition of the facility is coupled with various services, such as a free analysis service, or the trouble-free removal of spent baths by Heraeus. Heraeus Kulzer GmbH, Bereich Heraeus Edelmetalle, Lameystraße 17, No-residue Flux D-7530 Pforzheim, Germany. Multicore Solders has introduced a new halide-free flux, X32-10i, which leaves no white residues or tide marks. Boards soldered correctly with the new flux pass the MIL-P-28809A ionic contamination test without cleaning, New Computerised System Allows Easier Solderabilily Testing thus reducing production costs and usage of ozone depleting substances. Multicore Solders has introduced a new solderability tester with integral User advantages of X32-10i include a wider operating window than other computer control for both surface mounted and leaded through-hole low solids content liquid fluxes and a high surface insulation resistance. components. Non-corrosive and thus safer than RMA fluxes, X32-10i facilitates fast Based on the proven wetting balance principle, the MUST (Multicore soldering on leaded through-hole components and surface mount devices Universal Solderability Tester) System II is the result of a development with no bridging or icicle formation. project between Multicore Solders, Philips, Siemens and the National Multicore Solders Ltd, Kelsey House, Wood Lane End, Hemel Hempstead, Physical Laboratory with the assistance of a BRITE Research Award from Herts. HP2 4RQ. Telephone: (0442) 233233. Telex: 82363 KELSEY G. Fax: the European Community. (0442) 69554. More accurate and easier to operate than earlier systems, the MUST System II offers Quality Control users a wide range of feature benefits. These include storage and recall of component data, test parameters and Polyimide Based Prepreg results , colour graphic display facilities, automatic component alignment and multi-lead component testing capability, and automatic pass/fail Hitachi Chemical has developed a unique polyimide based prepreg, analysis. GIA-67N(F), for filling clearance holes of CIC in multilayer PCBs. Instead Bespoke software takes the operator systematically through each test and of filling the holes manually with powder, the prepregs are laminated just controls the semi-automatic interchange of solder bath and globule block like any other prepreg and such clearance holes will be completely filled for through hole or SMT component testing, as well as the movement of without any cracks. These prepregs can also be used as dielectric insulation a safety cover to prevent user contact with molten solder. of standard prepregs. Test parameters comply with IEC 68-2-54, IPC S-804B, IPC S-805, MIL- Hitachi Chemical Europe GmbH, Immermannstr. 43, D-4000 Germany. STD-883 method 2022, ANSI/J-STD-002 and ANSI/J-STD-003. The Telephone: 0211-350366. Fax: 0211-161634. system can also be used for edge dip testing in compliance with IEC 68-2-20, 68-2-58, IPC-S-804B, IPC-S-805, MIL-STD-202 method 208F, ANSI/J- STD-002 and ANSI/J-STD-003. Accurate Measurement of Solder Paste Thickness Multicore Solders Ltd, Kelsey House, Wood Lane End, Hemel Hempstead, Herts. NP2 4RQ. Telephone: (0442) 233233. Telex: 82363 KELSEY G. Fax: With the trend to ever closer lead spacing, the thickness of printed solder (0442) 69554. paste is fast becoming a critical factor for bridge-free reflow soldering. A new instrument from Alpha Metals—the Hi-Check—is a compact, economical unit which gives highly accurate measurements of solder paste New PCB Exposure Unit Provides Greater Light Intensity, Faster Processing thickness. The system is simplicity itself to use and is accurate down to ±3 microns, enabling the user to measure easily if either too much or too Du Pont Electronics chose Productronica in Munich for the first public little solder paste has been printed. showing of its new PC300 Printer for the PCB manufacturing industry. The Alpha Hi-Check works by differentially focusing between the sample Built by W. Staub GmbH, the specialist German PCB equipment surface and the to p of the solder paste being measured, the unique optical manufacturer, the new exposure unit provides twice the light intensity sighting system overcoming any operator error. A micro slit of light is produced by Du Pont's PC130 Printer, with a collimation angle of only projected at an angle onto the substrate of the sample and adjusted to 2 degrees. This results in faster and more uniform exposure of the dry film coincide with the central graticule in the eyepiece—the subject is then in photoresist, making it easier to produce the straight conductor line side- focus. When the light is positioned onto printed paste, the micro slit moves walls needed for fine line circuitry. Consequential advantages are improved laterally and by bringing it back into focus, the height of solder is measured, first-pass yields, higher productivity and increased profitability. this being the difference between the initial and secondary focus positions. The PC300 Printer has a usable exposure area of 610 x 760 mm and Metric or imperial readout is via a high contrast zeroable LCD display and features two drawers with double frames which are capable of handling it can also be linked either to a serial printed with RS232 interface, or into two double-sided printed circuit boards at the same time. Once the boards SPC systems with the same output port. have been loaded and the frame lid closed, exposure takes place The compact Hi-Check unit has overall dimensions of 500 x 260 x 400 mm automatically according to a pre-determined computer programme. high, and weighs around 28 kg, making it ideal for positioning near or on Exposure times are typically only 4 seconds for the well-known Riston line. 4200 Series and for the new 4700 and 4800 Series aqueous resists and, since the IR light gets separated out, the phototool remains cool even under Alpha Metals Ltd, 1 The Broadway, Tolworth, Surbiton, Surrey, England. continuous production conditions. This enhances the dimensional stability Telephone: 081-390 7011. Telex: 929818.
Circuit World – Emerald Publishing
Published: Jan 1, 1992