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Bare/Loaded Substrate Tester Universal Software for Laser Trimming Systems Bath Scientific Ltd of Melksham, Wiltshire, has launched a high speed Softlink has announced two universal software products for use with version of its PrecisionProbe bare/loaded substrate tester. The new version the various laser trimming systems currently available on the market. is aimed at higher throughput manufacturers in Europe. T o overcome the At present, hybrid manufacturers frequently use several types of laser limitations of jigs and fixtures, the system uses moving probe technology trimming system from different sources. This heterogeneous approach tends under software control and is available as a single-sided or concurrent to result in rather laborious setting-up and operating procedures. Each double-sided test system with up to four probes per surface (maximum eight system has its own information technology environment and therefore its in total). own programming language. Velocity in the X and Y axes has been improved so that probes get into T o put an end to these difficulties, the company has developed two position faster, and the Z axis function has also been improved to speed universal software systems which offer unique advantages to companies up the probing execution. This halves the overall test time and doubles test using different laser systems. The Federator, which links with ESI, CLS throughput. Probe resolution remains very precise, at better than 0· 6 thou and Teradyne lasers, is a universal platform for applications development (0·0006 in.). and quality control, and the Expert Programmer is a universal applications CAD data download provides positional co-ordinates and allows the generator incorporating a unique language for use with ESI, CLS and system to test directly against the design database. Enhanced software also Teradyne. The two systems allow the engineer complete freedom to choose scans and maps substrates and will scale and revise the database to cope from the laser trimming systems available the one best suited to the with movement, shrinkage and random misalignment sometimes production task in which he is engaged. encountered in co-fired ceramics etc. A vital aid t o the program developer, the two linked systems form a tool which will select the parameters best suited to the task in hand—for example, Bath Scientific Ltd, Lysander Road, Bowerhill Estate, Melksham, Wiltshire the type of trim to make in order to obtain the best results as regards SNI2 6SP. Telephone: (0225) 706707. accuracy or adjusted resistor stability. They also link up with the CAD Silver Glass Die Attach Adhesives system, providing an integrated system for engineering and production. Softlink, Z. A. du Madre, rue d'Orsonville, 91410 Dourdan, France. Ablestik Laboratories have developed a product which allows large ICs Telephone: (33) (1) 64 59 53 25. Fax: (33) (1) 64 59 36 97. with fine feature geometries to be bonded into ceramic packages. Ablebond uses a patented glass system, the silver glass adhesives fire at a peak Automated Semiconductor Lead Inspection temperature of 350°C and no pre-drying is required for die sizes up to 700 mil2. Robotic Vision Systems, Inc. has introduced an automated high-speed 3-D semiconductor lead inspection system with in-tray scanning. Ablestik Laboratories, Station Road, Linton, Cambridge CBI 6NW. The LS-2000 uses the company's proprietary laser scanning technology Telephone: (0223) 893771. to rapidly acquire 3-D measurements from semiconductor leads. The Component Tester measurements are then used to automatically evaluate characteristics including lead coplanarity, pin spread at tip (pitch), pin width, pin gap, Tantalum capacitors are notoriously difficult to check for polarity. To footprint, stand-off and lead angle. Optional equipment sorts defective ensure correct insertion of these polarised capacitors, the new SADS devices into reject or rework trays, and replaces the defective devices with component tester available from K H Benz Ltd checks all parameters in acceptable ones. typically 120 ms. The elimination of handling from the inspection process can significantly During the test the capacitance of the component is checked, its polarity reduce the expense of lead damage, and in-tray inspection allows established and a voltage test up to 1000 V is carried out. Handling and manufacturers to be sure that, after devices have been declared acceptable, preforming equipment can readily be connected to the SADS component they will be shipped to the customer with no further handling. As regards tester. The tester itself is PC controlled and is supplied complete with a high resolution inspection capability, the system has a 3-D measurement bar code reader and modem. The test programs are automatically generated resolution of 0·0625 mils. and there is provision for direct linking to CAD systems. Robotic Vision Systems, Inc., 425 Rabro Drive East, Hauppauge, New York Apart from testing tantalum capacitors, other components such as coils, 11788, USA. Telephone: (516) 273-9700. Telex: 383270. resistors, semiconductors, LCDs and LEDs can be tested fully and quickly. K H Benz Ltd, C4 Acre Business Park, Acre Road, Reading, Berkshire New Conductor Composition Offers Improved Solderability and Fine Line RG2 0SA. Telephone: (0734) 753876. Fax: (0734) 753554. Resolution Fine Line Auto-print Palladium Sil\er Conductor Du Pont has introduced a new 1:3 palladium-silver conductor composition which gives improved solderability and provides a thin, dense film capable EMCA/Remex have launched a modified version of their palladium silver of resolving conductor lines and spaces of 150 microns or less. conductor C3425-1. C3424-2 is designed specifically for large area printing Designated 7484, the new conductor composition was developed in with line definition down to 5 mil. This material gives no variation in the Europe using advanced statistical design techniques to optimise product fired form from C3425-1, so minimising evaluation and speeding acceptance. performance and enhance reproducibility. It incorporates a new binder EMCA/Remex, Station Road, Linton, Cambridge CBI 6NW. Telephone: material and a new, finer metal powder which provide a thin smooth fired (0223) 893771. surface, improved coverage and lower cost. It is easy to print, incorporates the latest advances in rheology control Advanced Outer Lead TAB Bonder to reduce spreading and can be air-fired at 850°C on firing cycles of 30 Anorad Corporation has announced a new OLB TAB bonder, the to 60 minutes. FPB-O-200. This system has been developed as an automatic, machine vision 7484 conductor composition claims to offer excellent solder acceptance alignment, high accuracy placement, outer lead gang bonder for bonding and aged adhesion both on alumina and over the company's 5704 dielectric, fine pitch TAB components to multichip substrates. The system features as well as excellent bondability with 250 micron aluminium wire. 5 micron placement accuracy over a 6 in x 6 in. placement area achieved Du Pont de Nemours International S.A., P.O. Box 50, 2 chemin du by a precision X, Y, Z and 0 servo-controlled substrate table and an Pavilion, CH-1218 Le Grand Saconnex, Geneva, Switzerland. Telephone: automatic self levelling bond head. The system incorporates a high resolution (022) 717 52 54. machine vision system for prebond TAB tape lead inspection, best-fit lead- to-substrate pad alignment and post bond alignment inspection. Computer- Flip Chip Bonder controlled bond force, bond temperature and bond time parameters are controlled in realtime, offering the end user complete process control of In addition to its fully automated flip chip system, the MRS1-503, Micro the outer lead bond process. A PC-AT based controller presents a familiar, Robotics Systems, Inc., is now offering a manual flip chip system—the user-friendly operator interface through a colour, menu-driven display MRSI-503M. The system includes precision optics and mechanisms to locate software system. components, make appropriate adjustments, and assemble with high The FPB-0200 is a fully integrated system. It provides the user with precision. The process is now being used in multi-chip modules to precision trim, form and excise tooling for singling the TAB component, accommodate the growing number of interconnections and chip I/Os. as well as a high speed, servo motor driven pick and place mechanism. Special features include substrate and chip viewing; single/multiple fields- All components are mounted to a vibration free, precision lapped granite of-view; fixed or zoom optics for versatility; dark/light field illumination; base. Product changeover procedures are quick, reliable and easy to follow optional planarisation and heated stages; optional ultrasonic scrub; and with process data storage and retrieval via floppy disk. space-saving bench-top design. Anorad Corporation, 110 Oser Avenue, Hauppauge, NY 11788, USA. Micro Robotics Systems, Inc., 25 Industrial Avenue, Chelmsford, MA Telephone: (516) 231 1995. Fax: (516) 435 1612. 01824, USA. Telephone: (508) 256 4950. Fax: (508) 256 5120.
Microelectronics International – Emerald Publishing
Published: Feb 1, 1991
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