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Electrically Conductive Adhesive for Solder Replacement Thermoplastic Die Attach Adhesives ABLEBOND 8175 electrically conductive adhesive is designed for Alpha Metals has launched a range of thermoplastic die attach adhesives solder replacement in microelectronic applications. This stress-absorbing and adhesive films, following an agreement made with the manufacturers, adhesive may be used with thick film metallisations or electrodeposited Staystik Inc. The new adhesives have been developed for die attach in copper surfaces. It provides improved line and thickness resolution. 8175 both chip packaging and hybrid circuitry and a comprehensive range is is screen printable and is capable of resolving a 20-mil pitch. It exhibits now available to the UK electronics market. excellent adhesion after temperature cycling and humidity testing. Staystik adhesives and Stayform adhesive films are based on thermoplastic chemistry and have electrical and/or thermal properties, ABLESTIK LABORATORIES, Premiere House, Station Road, Linton, designed to provide higher reliability and better application technology Cambridge CB1 6NW Telephone: 0223 893771. Fax: 0223 893546. compared with epoxies and polyimides. They offer thermal conductivity, thermal conductivity with electrical isolation or full insulation properties for a variety of applications. High Capacitance Dielectrics Staystik heat activated adhesive pastes can be syringe dispensed, hand probed and screen printed, and require no mixing or curing. They can be EMCA-REMEX have introduced three new capacitor dielectrics with stored at room temperature and are designed to have a shelf life of 6 Z5U T.C.C. performance, which can be fired from 850° - 950°C. months plus. The 7231 and 7233 may be blended to offer capacitance values in the The Stayform silver filled heat activated adhesive films, unlike many range 170 to 550 nF per square inch. They are compatible with both low similar products, are available in a choice of thicknesses—varying from cost conductors as well as gold, thus offering the designer maximum 0.001 in. - 0.010 in., and are particularly suitable for a wide range of MCM flexibility. and hybrid substrate/packaging applications which require electrical and The 7236 dielectric has been manufactured to offer capacitance as high thermal conducting properties. Application is by quick melt lamination as 750 nF per sq inch, when terminated with the 2633 pure silver without curing, unlike epoxy and polyimide adhesives, and because of no conductor. edge oozing even at melt, drastic undercutting is not necessary. Stayform A further feature of all three formulations, is that when used in films have excellent thermal stability and are easily reworked. They also conjunction with the EMCA-REMEX 7601 dielectric, it is possible to fire require no refrigeration and have a 12 month shelf life, giving easier resistors directly over the capacitor, which enables compact high scheduling and reduced spoilage. performance capacitor/resistor networks to be produced. Staystik and Stayform adhesives give no out-gassing, have high thermal EMCA-REMEX Products Station Road, Linton, Cambridge CB1 6NW stability and offer rapid processing capabilities. Lower processing Telephone: +44 (0) 223 8937711 Fax: (0223) 893546. temperatures reduce die stress and make rework of expensive die and packages a practical proposition. The majority of the products in the range have been assessed over the New Thick Film Materials for 'Chip on Glass' Applications last two years and have gained USA MIL-STD-883 approval, whilst further extensive evaluation is currently underway in a number of prominent The growing importance of flat panel display technology has led to UK chip packaging and hybrid companies. increasing demands for novel, compact, interconnection methods for the Alpha Metals Ltd, I The Broadway, Tolworth, Surbiton, Surrey, England. display driver electronics. Telephone: 081-390 7011. Telex: 929818. A solution to this interconnection challenge, which offers real benefits in terms of space and component reduction, is the use of 'Chip on Glass' (COG). In this technology the full driver electronics system, including unpackaged chips, is integrated directly onto the glass of the display Water Soluable Paste panel. A new water soluble paste, type R587, has been developed by Litton To enable this technology, novel, thin printing, low temperature firing thick film pastes have been developed by Ferro. Kester Solder to meet the needs of the electronics manufacturing industry working to the rapidly approaching deadline for the cessation of use of Originally introduced into the Japanese market, the materials include silver, silver-palladium, nickel and gold conductors, as well as sealing CFCs for cleaning rosin residues glasses special low temperature dielectrics used for 'rib' and 'barrier' The paste exhibits better screen life, longer track time and extended structures. reflow profile cycle than previous types, and conforms nearer to RMA Data sheets and samples of the materials are now available for the performance. European market. Major OEMs are now designing in this material after extensive trials both in the UK and overseas. Ferro Electronic Materials Division, Obere Vorstadt 16, W7032 Sindelfingen, Germany. Telephone: 07031 809 003. Fax: 07031 809 694. Litton Precision Products International Inc., 6 First Avenue, Globe Park, Marlow, Bucks SL7 1YA. In-line Assembly Work Cell for MCM, Microwave, Hybrid and COB CLS Launch SMT Trimmer MRSI, supplier of high-precision inspection and assembly equipment for the microelectronics industry, has announced the introduction of the Chicago Laser Systems have released preliminary information on their MRSI-505 Assembly Work Cell. The in-line gantry system supports new SMT Trimmer, which allows chip resistors to be trimmed on the many component attach technologies including chip and wire, flip chip board. and tape automated bonding (TAB). The 505 Work Cell, integrated with According to the company, this development achieves a considerable the MRSI-170G In-line Precision Dispensing System, makes a turn-key increase in throughput and accuracy, while reducing component and test solution for die attach, dispensing and material handling available for the costs. The Trimmer can be easily interfaced with existing handling first time. equipment. The product offers ultra-precision (± 0.0005 in.) and high speed (up to Operational features include pattern recognition, wide trimming area, 2,000 parts per hour). User benefits from the ultra-precision placement autofocus and integrated functional trim capability. include improved yield and reduced rework. The modular design and in- CLS claim to be leading the market in thick film laser trimming line materials handling mean that the microelectronics industry can techniques. They provide dedicated applications support from technical centres in England, Germany and France and are represented throughout realise the same economic benefits normally associated with the higher Europe. volume surface mount assembly industry. Robin Bancroft, Chicago Laser Systems Ltd, No, 8 Manfield Park, MRSI, 25 Industrial Avenue, Chelmsford, MA 01824, USA. Telephone: Guildford Road, Cranleigh, Surrey GU6 8PT. Telephone: (0483) 268123. (508) 256 4950. Fax: (508) 256 5120.
Microelectronics International – Emerald Publishing
Published: Feb 1, 1992
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