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New Polymeric Multilayer Substrates and Packaging

New Polymeric Multilayer Substrates and Packaging This paper reports on the development of a simple manufacturing process for polymeric multilayer substrates utilising the thermoplasticity of thermoplastic resin. Features and defects noted in manufacturing trials of the substrates are also reported. The process involves a polymerbased thick film conductive paste screen printed on a holepunched thermoplastic resin film and dried. The films are stacked to form multiple layers and are then compressed into one unit. As the extremely thin thermoplastic resin film layers are equivalent to a single layer, a feature of this substrate is its exceptional thinness. As thermoplastic resin is used as a base material, the soldering process and other connecting technologies which may be used in place of solder connection are also examined. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

New Polymeric Multilayer Substrates and Packaging

Circuit World , Volume 17 (2): 5 – Jan 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046124
Publisher site
See Article on Publisher Site

Abstract

This paper reports on the development of a simple manufacturing process for polymeric multilayer substrates utilising the thermoplasticity of thermoplastic resin. Features and defects noted in manufacturing trials of the substrates are also reported. The process involves a polymerbased thick film conductive paste screen printed on a holepunched thermoplastic resin film and dried. The films are stacked to form multiple layers and are then compressed into one unit. As the extremely thin thermoplastic resin film layers are equivalent to a single layer, a feature of this substrate is its exceptional thinness. As thermoplastic resin is used as a base material, the soldering process and other connecting technologies which may be used in place of solder connection are also examined.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1991

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