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New materials and challenges in build‐up, RF and high speed applications – an overview

New materials and challenges in build‐up, RF and high speed applications – an overview Miniaturization, with increased functionality and use of high‐density packages is a rapidly growing facet of the electronics industry. Low loss materials for high frequency applications, low D k materials applied for high speed signal propagation and build‐up films used in semi‐additive processes (SAP) for flip‐chip applications (line width/space down to 20 μm/20 μm) are receiving more attention. It is believed that these high performance materials will lead the electronic industry to the next level. In this paper, an overview of materials, their properties, applications and manufacturability will be addressed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

New materials and challenges in build‐up, RF and high speed applications – an overview

Circuit World , Volume 29 (4): 6 – Dec 1, 2003

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References (3)

Publisher
Emerald Publishing
Copyright
Copyright © 2003 MCB UP Ltd. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120310478550
Publisher site
See Article on Publisher Site

Abstract

Miniaturization, with increased functionality and use of high‐density packages is a rapidly growing facet of the electronics industry. Low loss materials for high frequency applications, low D k materials applied for high speed signal propagation and build‐up films used in semi‐additive processes (SAP) for flip‐chip applications (line width/space down to 20 μm/20 μm) are receiving more attention. It is believed that these high performance materials will lead the electronic industry to the next level. In this paper, an overview of materials, their properties, applications and manufacturability will be addressed.

Journal

Circuit WorldEmerald Publishing

Published: Dec 1, 2003

Keywords: Miniaturization; Electronics industry

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