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New High Yield, High Reliability Materials System for Silver Multilayer Construction

New High Yield, High Reliability Materials System for Silver Multilayer Construction Complex mixed metallurgy multilayers require a very robust dielectric to withstand shorting or blistering effects, together with high density for longterm reliability in humid environments. The development and performance of a new multilayer dielectric which meets these needs is presented here. A dielectric frit chemistry has been developed with a view to eliminating short circuits and blistering induced by the proximity of dissimilar metallurgies on multiple refiring. Appropriate filler technology has also been developed to optimise dielectric density, toughness and lasertrim properties. High density has yielded excellent HBT High Bias Temperature and HHBT High Humidity Bias Test performance. Data on multilayer circuit bowing are presented which take account of the interaction of conductor frit and the dielectric on firing. Silver conductor is employed in inner layers to optimise conductivity and cost. A new 13 PdAg conductor for termination of components and resistors also permits heavy Al wire bonding with good aged performance. 25 m Au and 37 m Al wire bonding is facilitated by gold conductor on dielectric. The laser trim characteristics of a new resistor series on dielectric are described. The materials system has been tested in a complex multilayer structure which, with the use of a new silver via fill conductor, resulted in defectfree circuits with zero yield loss. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

New High Yield, High Reliability Materials System for Silver Multilayer Construction

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044485
Publisher site
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Abstract

Complex mixed metallurgy multilayers require a very robust dielectric to withstand shorting or blistering effects, together with high density for longterm reliability in humid environments. The development and performance of a new multilayer dielectric which meets these needs is presented here. A dielectric frit chemistry has been developed with a view to eliminating short circuits and blistering induced by the proximity of dissimilar metallurgies on multiple refiring. Appropriate filler technology has also been developed to optimise dielectric density, toughness and lasertrim properties. High density has yielded excellent HBT High Bias Temperature and HHBT High Humidity Bias Test performance. Data on multilayer circuit bowing are presented which take account of the interaction of conductor frit and the dielectric on firing. Silver conductor is employed in inner layers to optimise conductivity and cost. A new 13 PdAg conductor for termination of components and resistors also permits heavy Al wire bonding with good aged performance. 25 m Au and 37 m Al wire bonding is facilitated by gold conductor on dielectric. The laser trim characteristics of a new resistor series on dielectric are described. The materials system has been tested in a complex multilayer structure which, with the use of a new silver via fill conductor, resulted in defectfree circuits with zero yield loss.

Journal

Microelectronics International – Emerald Publishing

Published: Jan 1, 1993

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