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Multilayer thickfilm microwave components and measurements

Multilayer thickfilm microwave components and measurements The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thickfilm technology. The techniques described employ several layers of metal sandwiched by thickfilm dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thickfilm technology, offers a viable and economic solution to achieve highdensity, highperformance microwave circuits. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Multilayer thickfilm microwave components and measurements

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360310455472
Publisher site
See Article on Publisher Site

Abstract

The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thickfilm technology. The techniques described employ several layers of metal sandwiched by thickfilm dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thickfilm technology, offers a viable and economic solution to achieve highdensity, highperformance microwave circuits.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 1, 2003

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