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/lp/emerald-publishing/multilayer-thickfilm-microwave-components-and-measurements-yKYSQT4pjv
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360310455472
- Publisher site
- See Article on Publisher Site
Abstract
The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thickfilm technology. The techniques described employ several layers of metal sandwiched by thickfilm dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thickfilm technology, offers a viable and economic solution to achieve highdensity, highperformance microwave circuits.
Journal
Microelectronics International – Emerald Publishing
Published: Apr 1, 2003