Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Multilayer thick-film ceramic for multichip modules with laser microvias

Multilayer thick-film ceramic for multichip modules with laser microvias PurposeThe purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices for space, aerospace, medical and industrial applications since many years. The combination of classic thick-film printing with advanced technologies for fine line structuring provides substrates best suited for packaging solutions with challenging requirements, such as temperature stability and extended product lifetime. Combined with state of the art assembly technologies, thick-film substrates are used in highly demanding industries.Design/methodology/approachIn recent years, several technologies for fine line structuring have been introduced, e.g. fine line printing, photo imaging, etching, laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via) diameters to connect the layers should be addressed.FindingsThe focus of this paper is to show the results of combining fine line structuring with laser microvias and to compare laser drilling in thick-films with different established via forming technologies.Originality/valueThe reduction of via size to 60 µm – smaller than 50% compared to using state-of-the-art printing technologies enables a solution for significant relaxation of current design possibilities. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Multilayer thick-film ceramic for multichip modules with laser microvias

Download PDF
6 pages

Loading next page...
 
/lp/emerald-publishing/multilayer-thick-film-ceramic-for-multichip-modules-with-laser-x2uJR0w5kk
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/MI-11-2017-0065
Publisher site
See Article on Publisher Site

Abstract

PurposeThe purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices for space, aerospace, medical and industrial applications since many years. The combination of classic thick-film printing with advanced technologies for fine line structuring provides substrates best suited for packaging solutions with challenging requirements, such as temperature stability and extended product lifetime. Combined with state of the art assembly technologies, thick-film substrates are used in highly demanding industries.Design/methodology/approachIn recent years, several technologies for fine line structuring have been introduced, e.g. fine line printing, photo imaging, etching, laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via) diameters to connect the layers should be addressed.FindingsThe focus of this paper is to show the results of combining fine line structuring with laser microvias and to compare laser drilling in thick-films with different established via forming technologies.Originality/valueThe reduction of via size to 60 µm – smaller than 50% compared to using state-of-the-art printing technologies enables a solution for significant relaxation of current design possibilities.

Journal

Microelectronics International – Emerald Publishing

Published: Jul 2, 2018

References

  • Materials for diffusion-patterning; thick-film interconnections technology
  • Thickfilm ceramic ready for MCM Interposer