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Multilayer Rigidflex Printed Wiring Design Considerations

Multilayer Rigidflex Printed Wiring Design Considerations Rigidflex printed wiring constructed in different multilayer configurations and with varying features is discussed. Materials used in rigidflex construction have widely varying properties which cause processing difficulties and thermal stress related problems which can be minimised by proper construction features. Examples of failure mechanisms due to improper construction or material usage are given. Design considerations which will avoid construction related defects are summarised. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Multilayer Rigidflex Printed Wiring Design Considerations

Circuit World , Volume 13 (4): 5 – Mar 1, 1987

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043896
Publisher site
See Article on Publisher Site

Abstract

Rigidflex printed wiring constructed in different multilayer configurations and with varying features is discussed. Materials used in rigidflex construction have widely varying properties which cause processing difficulties and thermal stress related problems which can be minimised by proper construction features. Examples of failure mechanisms due to improper construction or material usage are given. Design considerations which will avoid construction related defects are summarised.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1987

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