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Multichip Modules for Telecom Applications

Multichip Modules for Telecom Applications System performance can be improved by the use of MCM multichip module technology. Better signal transmission properties, lower power dissipation if CMOS chips are used and decreased physical volume will be obtained. Today MCM is an expensive technique, but the authors' cost analysis shows that it has the potential to become more costeffective than the standard technique of using single chip packages. It can also become more costeffective to use the MCM technique than to increase the number of gates on the silicon chip over a certain level. In order to study the properties of MCM technology, a project has been started at the authors' company in which a processor application is built up on three different types of MCM substrates. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Multichip Modules for Telecom Applications

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044448
Publisher site
See Article on Publisher Site

Abstract

System performance can be improved by the use of MCM multichip module technology. Better signal transmission properties, lower power dissipation if CMOS chips are used and decreased physical volume will be obtained. Today MCM is an expensive technique, but the authors' cost analysis shows that it has the potential to become more costeffective than the standard technique of using single chip packages. It can also become more costeffective to use the MCM technique than to increase the number of gates on the silicon chip over a certain level. In order to study the properties of MCM technology, a project has been started at the authors' company in which a processor application is built up on three different types of MCM substrates.

Journal

Microelectronics InternationalEmerald Publishing

Published: Feb 1, 1991

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