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Modelling of microstructure and damage evolution in Sn‐Pb solder

Modelling of microstructure and damage evolution in Sn‐Pb solder Purpose – This paper aims to present a viscoplastic constitutive model of Sn‐Pb solder taking into account the evolution of microstructure and damage growth in the material. Design/methodology/approach – The microstructure evolution is represented by a parameter describing the coarsening of the phase size, and its resulting evolution equation is established from previous experimental data. The damage evolution is derived from the theory of damage mechanics within the framework of irreversible thermodynamics. Both a phase‐size parameter and a damage variable are included in the constitutive model. Findings – The model is capable of simulating the effects of Sn‐Pb solder microstructure on mechanical behaviour for both bulk material and miniature specimens under monotonic tensile loading. It was found that the expected failure location determined using the phase‐size criterion is identical to that using the damage criterion, but differs from that determined using the von Mises stress criterion. Originality/value – Microstructure and damage evolution are modelled for Sn‐Pb solder. Some simulation results are compared with the experimental data to provide the necessary validation of the damage/microstructure‐coupled constitutive model. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Modelling of microstructure and damage evolution in Sn‐Pb solder

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References (13)

Publisher
Emerald Publishing
Copyright
Copyright © 2006 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910610647107
Publisher site
See Article on Publisher Site

Abstract

Purpose – This paper aims to present a viscoplastic constitutive model of Sn‐Pb solder taking into account the evolution of microstructure and damage growth in the material. Design/methodology/approach – The microstructure evolution is represented by a parameter describing the coarsening of the phase size, and its resulting evolution equation is established from previous experimental data. The damage evolution is derived from the theory of damage mechanics within the framework of irreversible thermodynamics. Both a phase‐size parameter and a damage variable are included in the constitutive model. Findings – The model is capable of simulating the effects of Sn‐Pb solder microstructure on mechanical behaviour for both bulk material and miniature specimens under monotonic tensile loading. It was found that the expected failure location determined using the phase‐size criterion is identical to that using the damage criterion, but differs from that determined using the von Mises stress criterion. Originality/value – Microstructure and damage evolution are modelled for Sn‐Pb solder. Some simulation results are compared with the experimental data to provide the necessary validation of the damage/microstructure‐coupled constitutive model.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jan 1, 2006

Keywords: Solders; Minimalist manufacturing; Modelling; Failure modes and effects analysis; Mechanics

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