Mixed‐mode stress intensity factors of a three‐dimensional crack in a bonded bimaterial

Mixed‐mode stress intensity factors of a three‐dimensional crack in a bonded bimaterial Purpose – This paper aims to calculate the mixed‐mode stress intensity factors (SIFs) of a 3D crack meeting the interface in a bimaterial under shear loading by a hypersingular integral equation (HIE) method, And further to assess the accuracy of numerical solutions for the mixed mode SIFs along the crack front. Design/methodology/approach – A 3D crack modeling is reduced to solving a set of HIEs. Based on the analytical solutions of the singular stress field around the crack front, a numerical method for the HIEs is proposed by a finite‐part integral method, where the displacement discontinuities of the crack surface are approximated by the product of basic density functions and polynomials. Using FORTRAN program, numerical solutions of the mixed‐mode SIFs of some examples are presented. Findings – The numerical method is proved to be an effective construction technique. The numerical results show that this numerical technique is successful, and the solution precision is satisfied. Research limitations/implications – This work takes further steps to improve the fundamental systems of HIE for its application in the fields of arbitrary shape crack problems. Propose several techniques for numerical implementation, which could increase the efficiency and accuracy of computation. Practical implications – Whenever there is a structure containing the 3D crack, the analysis method described in this paper can be utilized to find the critical configurations under which the structure may be most vulnerable. In such cases, the strength predictions would be safer if the crack could be taken into account. Originality/value – This paper is the first to apply HIE method to analyzing the mixed‐mode crack meeting the interface in 3D dissimilar materials. Numerical solutions of the mixed‐mode SIFs can give the satisfied solution precision. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Engineering Computations Emerald Publishing

Mixed‐mode stress intensity factors of a three‐dimensional crack in a bonded bimaterial

Engineering Computations, Volume 25 (3): 17 – Apr 4, 2008

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Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0264-4401
DOI
10.1108/02644400810857083
Publisher site
See Article on Publisher Site

Abstract

Purpose – This paper aims to calculate the mixed‐mode stress intensity factors (SIFs) of a 3D crack meeting the interface in a bimaterial under shear loading by a hypersingular integral equation (HIE) method, And further to assess the accuracy of numerical solutions for the mixed mode SIFs along the crack front. Design/methodology/approach – A 3D crack modeling is reduced to solving a set of HIEs. Based on the analytical solutions of the singular stress field around the crack front, a numerical method for the HIEs is proposed by a finite‐part integral method, where the displacement discontinuities of the crack surface are approximated by the product of basic density functions and polynomials. Using FORTRAN program, numerical solutions of the mixed‐mode SIFs of some examples are presented. Findings – The numerical method is proved to be an effective construction technique. The numerical results show that this numerical technique is successful, and the solution precision is satisfied. Research limitations/implications – This work takes further steps to improve the fundamental systems of HIE for its application in the fields of arbitrary shape crack problems. Propose several techniques for numerical implementation, which could increase the efficiency and accuracy of computation. Practical implications – Whenever there is a structure containing the 3D crack, the analysis method described in this paper can be utilized to find the critical configurations under which the structure may be most vulnerable. In such cases, the strength predictions would be safer if the crack could be taken into account. Originality/value – This paper is the first to apply HIE method to analyzing the mixed‐mode crack meeting the interface in 3D dissimilar materials. Numerical solutions of the mixed‐mode SIFs can give the satisfied solution precision.

Journal

Engineering ComputationsEmerald Publishing

Published: Apr 4, 2008

Keywords: Boundary‐elements methods; Composite materials; Stress (materials)

References

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