Access the full text.
Sign up today, get DeepDyve free for 14 days.
C. Jain, S. Wang, K. Huang, T. Chuang (2009)
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu PadsJournal of Materials Engineering and Performance, 18
N. Lee, J. Slattery, John Sovinsky, I. Artaki, P. Vianco (1994)
A Novel Lead-Free Solder Replacement
Keun-Soo Kim, S. Huh, K. Suganuma (2003)
Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered jointsJournal of Alloys and Compounds, 352
T. Korhonen, J. Kivilahti (1998)
Thermodynamics of the Sn-In-Ag solder systemJournal of Electronic Materials, 27
S. Lin, Che-wei Hsu, Sinn-wen Chen, Chia-ming Hsu (2013)
Interfacial reactions in Sn-20In-2.8Ag/Cu couplesMaterials Chemistry and Physics, 142
M. Cheng, S. Chang, S. Yen, Tung-Han Chuang (2004)
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packagesJournal of Electronic Materials, 33
I. Artaki, A. Jackson, P. Vianco (1995)
Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder PasteSoldering & Surface Mount Technology, 7
(2007)
Silver-Indium-Tin
G. Vassilev, E. Dobrev, J. Tedenac (2005)
Experimental study of the Ag–Sn–In phase diagramJournal of Alloys and Compounds, 399
M. Yeh (2002)
Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solderJournal of Electronic Materials, 31
M. Yeh (2003)
Effects of indium on the mechanical properties of ternary Sn-In-Ag soldersMetallurgical and Materials Transactions A, 34
T. Chuang, H. Wu (2011)
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder JointsJournal of Electronic Materials, 40
Huiming Wu, Fengshun Wu, T. Chuang (2005)
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu padsJournal of Electronic Materials, 34
PurposeTo explore substitutes for traditional Sn-Pb solder, Sn-20In-2.8Ag was considered because of its appropriate melting temperature, good reliability and high ductility at less than 100°C. However, the mechanical properties of Sn-20In-2.8Ag were not satisfactory. The reason for the poor mechanical properties of the Sn-20In-2.8Ag/Cu joint was revealed, and a way to solve the problem was found.Design/methodology/approachThe microstructure evolution, characteristics of melting and solidification and joining performance with Cu were investigated using scanning electron microscopy (SEM), electron probe microanalysis, differential scanning calorimetry (DSC) and mechanical testing.FindingsSEM results showed that the microstructure of Sn-20In-2.8Ag was composed of coarse dendritic Ag2In and γ phases, with Ag2In distributed at the grain boundaries. DSC measurements revealed that small amount of low temperature eutectic reaction, L → Ag2In + β + γ, occurred at 112.9°C. This reaction was caused by the segregation of indium, which is a process that has a strong driving force. In the lap-shear testing, a crack propagated along the grain boundary of the solder, and failure showed an intergranular fracture. This failure was connected with the three-phase eutectic and coarse Ag2In. Thus, to improve the mechanical properties, segregation of indium should be reduced and coarsening of Ag2In should be prevented.Originality/valueThe reason for the unsatisfactory mechanical properties of Sn-20In-2.8Ag was revealed via microstructural observations and solidification analysis, and the way to solve this problem was found.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Feb 18, 2019
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.