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Microstructural and Mechanical Characterisation of 434314 TinLeadBismuth

Microstructural and Mechanical Characterisation of 434314 TinLeadBismuth A mechanical and microstructural study was performed of 434314 tinleadbismuth solder. This alloy melts lower than the commonly used tinlead solders and therefore holds promise as a useful material in twostep soldering processes or in processes with thermally sensitive components. Mechanical testing of 434314 tinleadbismuth showed a strength comparable to that of tinlead solders but increased creep rate. Microstructural analysis scanning electron microscopyenergy dispersive Xray exhibited the same mechanism of fatigue as for tinlead solders, viz., heterogeneous coarsening. Thermocyclic fatigue demonstrated that the longterm reliability of 434314 tinleadbismuth is comparable to that of tinlead solders. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Microstructural and Mechanical Characterisation of 434314 TinLeadBismuth

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037766
Publisher site
See Article on Publisher Site

Abstract

A mechanical and microstructural study was performed of 434314 tinleadbismuth solder. This alloy melts lower than the commonly used tinlead solders and therefore holds promise as a useful material in twostep soldering processes or in processes with thermally sensitive components. Mechanical testing of 434314 tinleadbismuth showed a strength comparable to that of tinlead solders but increased creep rate. Microstructural analysis scanning electron microscopyenergy dispersive Xray exhibited the same mechanism of fatigue as for tinlead solders, viz., heterogeneous coarsening. Thermocyclic fatigue demonstrated that the longterm reliability of 434314 tinleadbismuth is comparable to that of tinlead solders.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Mar 1, 1991

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