Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology Purpose – The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes. Design/methodology/approach – The properties and behavior of different combinations of soldering materials, PoP components and soldering profiles were investigated, both in the laboratory and during production trials. The purpose of such an approach was identification of existing problems and challenges in lead-free PoP systems assembly as well as checking which soldering material designed to PoP is more suitable for this technology. Findings – Technological trials are needed to select adequate soldering materials for PoP systems assembly, as laboratory tests of materials alone were not sufficient. The challenges of PoP technology were associated with the equipment utilized, the soldering materials, operational parameters and the soldering profile used for assembly. The localization of defects in PoP systems is very difficult and, in many cases, destructive methods have to be used on solder joints for the assessment and confirmation of failures. Originality/value – This paper shows main materials and soldering challenges in lead-free PoP technology. In particular, the problem related with selection of soldering materials and soldering profiles for PoP was presented. Moreover, the issues that have to be taken into consideration during the planning of a PoP system assembly procedure are presented. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Download PDF
5 pages

Loading next page...
 
/lp/emerald-publishing/materials-and-soldering-challenges-in-lead-free-package-on-package-pop-uGBoMVDrhb

References (5)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/SSMT-03-2015-0012
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes. Design/methodology/approach – The properties and behavior of different combinations of soldering materials, PoP components and soldering profiles were investigated, both in the laboratory and during production trials. The purpose of such an approach was identification of existing problems and challenges in lead-free PoP systems assembly as well as checking which soldering material designed to PoP is more suitable for this technology. Findings – Technological trials are needed to select adequate soldering materials for PoP systems assembly, as laboratory tests of materials alone were not sufficient. The challenges of PoP technology were associated with the equipment utilized, the soldering materials, operational parameters and the soldering profile used for assembly. The localization of defects in PoP systems is very difficult and, in many cases, destructive methods have to be used on solder joints for the assessment and confirmation of failures. Originality/value – This paper shows main materials and soldering challenges in lead-free PoP technology. In particular, the problem related with selection of soldering materials and soldering profiles for PoP was presented. Moreover, the issues that have to be taken into consideration during the planning of a PoP system assembly procedure are presented.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jun 1, 2015

There are no references for this article.