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Liquid Photoresist Techniques for Fine Pattern Flexible Printed Circuits

Liquid Photoresist Techniques for Fine Pattern Flexible Printed Circuits This paper presents a new rolltoroll RR production system modified for fine line patterning of flexible printed circuits FPCs using the subtractive method. The RR system is especially suited to production of FPCs because the material usedcopperclad laminate CCUcan be handled as it is rolled. Consideration has been given to methods and materials in designing the machines. They are now operating successfully and are used in singlesided flexible circuit manufacture. A liquid photosensitive etch resist and a collimated light source are recommended for the system and several factors necessary for achieving RR working conditions are discussed. Judging from the experimental results of these systems, using narrower width materials with chemical surface preparation is an effective technique for improving the yield rate. The selection of a liquid photoresist is not so common in the case of rigid printed circuit boards because of the difficulty of the coating process. On the other hand, in the case of flexible PCBs, it is successful not only in terms of resolution characteristics but also of productivity under several different types of coating conditions. It should be noted that use of the conventional subtractive method in the printed circuit field is still advantageous as some semiconductor technologies are applicable. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Liquid Photoresist Techniques for Fine Pattern Flexible Printed Circuits

Circuit World , Volume 17 (3): 5 – Feb 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046132
Publisher site
See Article on Publisher Site

Abstract

This paper presents a new rolltoroll RR production system modified for fine line patterning of flexible printed circuits FPCs using the subtractive method. The RR system is especially suited to production of FPCs because the material usedcopperclad laminate CCUcan be handled as it is rolled. Consideration has been given to methods and materials in designing the machines. They are now operating successfully and are used in singlesided flexible circuit manufacture. A liquid photosensitive etch resist and a collimated light source are recommended for the system and several factors necessary for achieving RR working conditions are discussed. Judging from the experimental results of these systems, using narrower width materials with chemical surface preparation is an effective technique for improving the yield rate. The selection of a liquid photoresist is not so common in the case of rigid printed circuit boards because of the difficulty of the coating process. On the other hand, in the case of flexible PCBs, it is successful not only in terms of resolution characteristics but also of productivity under several different types of coating conditions. It should be noted that use of the conventional subtractive method in the printed circuit field is still advantageous as some semiconductor technologies are applicable.

Journal

Circuit WorldEmerald Publishing

Published: Feb 1, 1991

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