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Lean transformation in a high mix low volume electronics assembly environment

Lean transformation in a high mix low volume electronics assembly environment Purpose– This paper aims to focus on integrating a lean framework in a high-mix-low-volume (HMLV) printed circuit board assembly (PCBA) environment to enhance current assembly processes and facility layouts. An HMLV PCBA environment is characterized by stochastic demands, a variety of products in terms of shapes and sizes and different sequences of assembly and test operations, in addition to long cycle times and high fall-out rates. Design/methodology/approach– Preliminary analysis indicates that the push inventory control system led to the longer cycle times, such that various lean methodologies have been applied to enhance the assembly operations. In this research, Kanban sizes for different assembly lines are also estimated to integrate and implement a “pull-system” into the lean framework. In addition, material movement and facility layout have been studied to minimize work-in-process travel time. An “iterative-MAIC” approach has been applied to implement lean principles. Findings– As a result, a lean manufacturing pilot line has been implemented to evaluate the effectiveness of the lean principles before rolling them out across the manufacturing floor. It has been shown that the cycle times of the pilot line products are decreased by 40 per cent and the number of defects decreased by 10-30 per cent, depending on different assembly processes, after the lean implementation. Originality/value– There is limited literature that addresses lean transformation in an HMLV electronics manufacturing service provider handling several product types with different testing methodologies, frequent product revision changes and higher fall-out rates. Hence, in this research, lean manufacturing has been implemented in an HMLV PCBA environment, which has the challenges of varying demand with a mix of assembly and test operations for different product families. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png International Journal of Lean Six Sigma Emerald Publishing

Lean transformation in a high mix low volume electronics assembly environment

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
2040-4166
DOI
10.1108/IJLSS-07-2013-0042
Publisher site
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Abstract

Purpose– This paper aims to focus on integrating a lean framework in a high-mix-low-volume (HMLV) printed circuit board assembly (PCBA) environment to enhance current assembly processes and facility layouts. An HMLV PCBA environment is characterized by stochastic demands, a variety of products in terms of shapes and sizes and different sequences of assembly and test operations, in addition to long cycle times and high fall-out rates. Design/methodology/approach– Preliminary analysis indicates that the push inventory control system led to the longer cycle times, such that various lean methodologies have been applied to enhance the assembly operations. In this research, Kanban sizes for different assembly lines are also estimated to integrate and implement a “pull-system” into the lean framework. In addition, material movement and facility layout have been studied to minimize work-in-process travel time. An “iterative-MAIC” approach has been applied to implement lean principles. Findings– As a result, a lean manufacturing pilot line has been implemented to evaluate the effectiveness of the lean principles before rolling them out across the manufacturing floor. It has been shown that the cycle times of the pilot line products are decreased by 40 per cent and the number of defects decreased by 10-30 per cent, depending on different assembly processes, after the lean implementation. Originality/value– There is limited literature that addresses lean transformation in an HMLV electronics manufacturing service provider handling several product types with different testing methodologies, frequent product revision changes and higher fall-out rates. Hence, in this research, lean manufacturing has been implemented in an HMLV PCBA environment, which has the challenges of varying demand with a mix of assembly and test operations for different product families.

Journal

International Journal of Lean Six Sigma – Emerald Publishing

Published: Oct 28, 2014

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