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Lead‐free solders in Japan (a personal impression)

Lead‐free solders in Japan (a personal impression) Impressions gained from two visits to Japan, discussing with representatives of industry and academe the current status regarding the implementation of lead‐free technology, are presented. Driven by the commercial rewards of lead‐free goods, Japan appears to have more clearly articulated targets for the removal of lead, in advance of the expected timescales in EU legislation. Various strategies for combating problems associated with the higher melting point of lead‐free solder alloys have been investigated. Design and development generally involve a broader approach than in Europe, involving stress analysis, materials properties and life prediction to underpin empirical data obtained by thermal cycling of boards. Despite the existence of several committees to facilitate the introduction of lead‐free solders, a lack of cohesion is sometimes apparent, particularly regarding heat treatment of materials prior to testing. It is proposed that a challenge as demanding as this would benefit from greater collaboration internationally. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Lead‐free solders in Japan (a personal impression)

W.J. Plumbridge
Soldering & Surface Mount Technology , Volume 12 (1): 3 – Apr 1, 2000
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References (20)

Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910010312410
Publisher site
See Article on Publisher Site

Abstract

Impressions gained from two visits to Japan, discussing with representatives of industry and academe the current status regarding the implementation of lead‐free technology, are presented. Driven by the commercial rewards of lead‐free goods, Japan appears to have more clearly articulated targets for the removal of lead, in advance of the expected timescales in EU legislation. Various strategies for combating problems associated with the higher melting point of lead‐free solder alloys have been investigated. Design and development generally involve a broader approach than in Europe, involving stress analysis, materials properties and life prediction to underpin empirical data obtained by thermal cycling of boards. Despite the existence of several committees to facilitate the introduction of lead‐free solders, a lack of cohesion is sometimes apparent, particularly regarding heat treatment of materials prior to testing. It is proposed that a challenge as demanding as this would benefit from greater collaboration internationally.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Apr 1, 2000

Keywords: Lead‐free soldering; Japan,

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