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ITRI project on electroless nickel/immersion gold joint cracking

ITRI project on electroless nickel/immersion gold joint cracking A problem exists with electroless nickel/immersion gold (E.Ni/I.Au) board surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open circuit. The solder joint cracks and separates when put under stress or when it experiences a shock. An ITRI (Interconnect Technology Research Institute) project to investigate this E.Ni/I.Au problem was initiated about a year‐and‐a‐half ago. Since the electroless nickel/immersion gold board finish performs satisfactorily most of the time, a 24 variable experiment was developed to investigate which parts of the chemical matrix are satisfactory to use and which need to be avoided. This paper describes some of the activities that have occurred on the ITRI consortium, from the design of the test vehicle to building hundreds of BGA assemblies, then pulling those BGA assemblies apart and inspecting the results. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

ITRI project on electroless nickel/immersion gold joint cracking

Circuit World , Volume 26 (2): 7 – Jun 1, 2000

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References (12)

Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120010310882
Publisher site
See Article on Publisher Site

Abstract

A problem exists with electroless nickel/immersion gold (E.Ni/I.Au) board surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open circuit. The solder joint cracks and separates when put under stress or when it experiences a shock. An ITRI (Interconnect Technology Research Institute) project to investigate this E.Ni/I.Au problem was initiated about a year‐and‐a‐half ago. Since the electroless nickel/immersion gold board finish performs satisfactorily most of the time, a 24 variable experiment was developed to investigate which parts of the chemical matrix are satisfactory to use and which need to be avoided. This paper describes some of the activities that have occurred on the ITRI consortium, from the design of the test vehicle to building hundreds of BGA assemblies, then pulling those BGA assemblies apart and inspecting the results.

Journal

Circuit WorldEmerald Publishing

Published: Jun 1, 2000

Keywords: Surface finishing; Solder joints; Fault analysis

There are no references for this article.