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Investigation of the effects of a pre-deposition heating system on the interfacial temperature and interlayer bonding strength for fused filament fabrication

Investigation of the effects of a pre-deposition heating system on the interfacial temperature... The purpose of this study is to propose the use of a pre-deposition heating system for fused filament fabrication (FFF) as a means to enhance interlayer bonding by elevating the substrate temperature. The effects of the heating on thermal profile at the bonding interface and the mechanical properties of three-dimensional printed parts are investigated.Design/methodology/approachA 12-W laser head is integrated to a commercial printer as the pre-deposition heating system. The laser beam heats up substate before the deposition of a fresh filament. Effects of laser powers are investigated and the thermal profile is measured with thermocouple, infrared camera and finite element model. The correlation between the temperature at the bonding interface and the bonding quality is investigated by conducting tensile testing and neck width measurement with microscope.FindingsThe pre-deposition heating system is proven to be effective in enhancing the inter-layer strength in FFF parts. Tensile testing of specimens along build direction (Z) shows an increase of around 50% in ultimate strength. A linear relationship is observed between the pre-deposition temperature at bond interface and bonding strength. It is evident that elevating the pre-deposition temperature promotes interlayer polymer diffusion as shown by the increased neck width between layers.Originality/valueThermocouples that are sandwiched between layers are used to achieve accurate measurement of the interfacial temperature. The temperature profiles under pre-deposition heating are analyzed and correlated to the interlayer bonding strengths. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Rapid Prototyping Journal Emerald Publishing

Investigation of the effects of a pre-deposition heating system on the interfacial temperature and interlayer bonding strength for fused filament fabrication

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Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
1355-2546
eISSN
1355-2546
DOI
10.1108/rpj-02-2021-0033
Publisher site
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Abstract

The purpose of this study is to propose the use of a pre-deposition heating system for fused filament fabrication (FFF) as a means to enhance interlayer bonding by elevating the substrate temperature. The effects of the heating on thermal profile at the bonding interface and the mechanical properties of three-dimensional printed parts are investigated.Design/methodology/approachA 12-W laser head is integrated to a commercial printer as the pre-deposition heating system. The laser beam heats up substate before the deposition of a fresh filament. Effects of laser powers are investigated and the thermal profile is measured with thermocouple, infrared camera and finite element model. The correlation between the temperature at the bonding interface and the bonding quality is investigated by conducting tensile testing and neck width measurement with microscope.FindingsThe pre-deposition heating system is proven to be effective in enhancing the inter-layer strength in FFF parts. Tensile testing of specimens along build direction (Z) shows an increase of around 50% in ultimate strength. A linear relationship is observed between the pre-deposition temperature at bond interface and bonding strength. It is evident that elevating the pre-deposition temperature promotes interlayer polymer diffusion as shown by the increased neck width between layers.Originality/valueThermocouples that are sandwiched between layers are used to achieve accurate measurement of the interfacial temperature. The temperature profiles under pre-deposition heating are analyzed and correlated to the interlayer bonding strengths.

Journal

Rapid Prototyping Journal – Emerald Publishing

Published: Jan 2, 2023

Keywords: Additive manufacturing; Fused filament fabrication; Interlayer bonding; Interfacial temperature

References

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